DocID022757 Rev 4

5/11

TN0873

Space-grade description

11

1.4.5

Visual test

All products must successfully pass the applicable ESCC space level visual test:

–

Discrete products: ESCC2045000

–

Integrated circuits: ESCC2049000

1.4.6

Conditioning & packing

Dice are packed in suitable antistatic waffle packs, vacuum sealed with adequate protection

in order to avoid contamination or mechanical stress during shipment and handling.

Each waffle pack contains dice from a single wafer.

The standard orientation of dice within each waffles depends on the product, as described

below. Contact ST for specific request:

•

CMOS4000B - HCMOS - MOSFET: all dice within any waffle have the same

orientation. Orientation may vary from one waffle to the other.

•

Diodes - bipolar transistors: the size of the dice doesn't allow to guarantee a single

orientation within a waffle.

Each waffle pack is marked as described below:

•

ST logo

•

Sales type reference

•

Wafer number

•

Diffusion lot number

•

Quantity of dice

•

ESD warning label identification.

1.5

Quality requirements

All documentation or traceability information corresponding to each ST space-grade dice is

retained for 10 years in a safe storage area.

Upon request, this traceability and documentation may be reviewed by the customer or a

copy provided, submitted to a lot charge defined by the ST sales area.