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AN668 Datasheet(PDF) 17 Page - STMicroelectronics

Part # AN668
Description  A New High Power IC Surface Mount Package Family
PDF  19 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

AN668 Datasheet(HTML) 17 Page - STMicroelectronics

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AN668 APPLICATION NOTE
5.
RELIABILITY DATA
The information presented in this section shows that
PowerSO-20/36 are able to work reliably in severe
environments, like automotive, where the requested
reliability target is 1 ppm failure rate.
In order to evaluate the reliability behavior of the
present package a complete qualification program
was compiled with two test vehicles:
- TDA7350A (Audio Power Amplifier)
- ABS voltage regulator
A list of the tests, their features and the failure modes
associated to these tests is given in Table 4.
Tables 5 and 6 show the results of the qualification; all
the package and die oriented tests were passed suc-
cessfully. The test conditions and acceptance criteria
are the same as those for standard power packages.
Table 4. Reliability tests description.
Table 5. ABS Voltage Regulator (die size 5.3 x 5.28mm)
Test
Features
Purpose
High Temperature Reverse Bias
(H.T.R.B.)
Reverse biased device at elevated
temperature
To detect surface defects like poor
passivation and contamination
Operating Life Test (O.L.T.)
Device submitted to application condi-
tions
To put in evedence thermomechanical
sresses induced by internal power
dissipation
Thermal Humidity Bias (T.H.B.)
Biased in presence of steam
Metal corrosion detection
Power ambient
Detect craked die, wire bond break-
ing, mechanical damage to package
Pressure Pot Test (P.P.T.)
High temperature and pressure with
saturated steam
Electrochemical and galvanic corro-
sion
Solderability Test (S.T.)
Verifies tinning process
Detects poor solder joint
Enviromental Sequence (E.S.)
Thermal cycling combined with pres-
sure pot
To stdy corrosion mechanism after
thermal cycling stress
Surface Mount (S.M.)
Simulation of soldering process in the
presence of humidity
To point out the package resistance to
the tresses due to surface mounting
in presence of humidity
Resistance toSolvens (R.S.)
Mil-Std-883 Meth. 2015
To verify the marking permanency
Test
Condition
Sample
Duration
Failure
T.C.T.
Tamb = -65°C to +150°C air to air
153 pcs. x 3 lots
153 pcs. x 1 lots
1000 cy
2000 cy
0
0
T.S.T.
Tamb = -65°C to +150°C liquid to liquid
60 pcs. x 3 lots
1000 cy
0
P.P.T.
Tamb = 121°C P = 2atm
77 pcs. x 3 lots
500hr
0
S.T. 1
Tamb = 215°C; precond. 8h vapor
22 pcs. x 3 lots
0
S.T. 2
Tamb = 215°C; precond. 8h vapor at
Tamb = 155°C
22 pcs. x 3 lots
0
E.S.
100cy at -65°C to +150°C 48hr of PPT at
3atm (5 Times Repeated)
25 pcs. x 3 lots
0
S.M.
24hr at 85°C/85%dipping at 260°C 10"48h
PPT at 2.5atm
22 pcs. x 3 lots
0
R.S.
Mil-Std-883 Meth 2015
22 pcs. x 3 lots
0



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