2/6

Doc ID 022904 Rev 1

1

Example of semi-slim notebook adaptor (25.4 mm

Figure 3 shows a typical cross section view of the semi-slim adaptor. The remaining

allowable component height is limited to 15.6 mm or less with all the device elements taken

into consideration.

Typically, the TO-220FP body height is already in the range of 15 to 16 mm, so in the case of

TO-220FP being used in a semi-slim adaptor design, the package body must be inserted

very close to the PCB, this means above the standoff of the leads of the package as shown

in the diagram. This may have a potential impact on device life-time performance.

Figure 3.

Semi-slim notebook adaptor (25.4 mm) when using TO-220FP

Full insertion of the TO-220FP body flush with, or very close to, the PCB may lead to

potential stress that can cause defects not only on the connection between leads and the

package body but also on the internal structure of the package. Potential damage may be

further aggravated by thermal stresses from soldering and operating conditions and any

failures can appear immediately at the final test or may be latent and show up in the field.

This potential damage may include:

●

mold compound delamination

●

leads bending or fracturing at standoff / Dambar area

●

cracked mold compound

●

soldering joint issues

Case (upper)

Case (bottom)

Clip

TO-281 (2PakFP)

Heatsink

PCB

Mylar Film (bottom)

Mylar Film (upper

)

2.0mm

1.0mm

2.0mm

3.0mm

1.0mm

0.4mm

0.4mm

25.4mm

Max 15.6mm

(need more

allowance

due to others

materials

Tolerance)

PCB

TO-220FP

TO-220FP is inserted

closed to body and

could cause potential

stress between leads

and package body

TO-220FP

body height

around 15 to16

mm

AM12600V1