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AN2036 Datasheet(PDF) 5 Page - STMicroelectronics

Part # AN2036
Description  Solderability Tests
PDF  7 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

AN2036 Datasheet(HTML) 5 Page - STMicroelectronics

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AN2036 - APPLICATION NOTE
When the measured wetting force is zero, the two forces are balanced. This point is called the “zero cross
time” (t0), and indicates the transition from no-wetting (overall force less than zero) to wetting (overall force
greater than zero).
Note: No aging is applied, before the wetting balance test, during process control of production. Aging is
applied for data collection purpose only.
Criteria: the test is considered as passed if:
–
The wetting force reaches 0.1mN/mm within 5 seconds of immersion
–
The zero cross time (t0) is less than 3 seconds.
Note: these criteria are applied for small-signal devices. Power devices can require different criteria to take
into account the thermal mass of their connections.
Table 3. Tests Conditions
Note:
–
The wetting force, as measured by the balance, is divided by the total perimeter of the connections at
initial immersion.
–
In the case of leads that are connected to a thermal mass, such as to a dissipater, the test must be
redefined to include preheating.
CONCLUSIONS
Through two standard tests (“Dip and Look” and “Wetting Balance”), ST Lead-free devices are warranted
to pass solderability tests using Sn-Pb solder or Sn-Ag-Cu solder, and so to meet all the requirements for
electronics soldering. In fact the solderability tests provide customers with an additional warranty that the
components can be soldered without affecting the common reliability performance.
Solder
Sn-Ag-Cu melted at 245°C (±5°C)
Flux dipping
5 to 10 seconds
Solder dipping
10 seconds
Sn-Pb melted at 235°C (±5°C)
Flux dipping
5 to 10 seconds
Solder dipping
10 seconds



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