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AN2860 Datasheet(PDF) 9 Page - STMicroelectronics

Part # AN2860
Description  EMC guidelines for STM8 microcontrollers
PDF  17 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

AN2860 Datasheet(HTML) 9 Page - STMicroelectronics

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AN2860
PCB layout recommendations
Doc ID 15267 Rev 5
9/17
3
PCB layout recommendations
Figure 1 and Figure 2 defines the appropriate bill of materials but, for EMC performance,
special attention must be paid to the layout which defines ground plane, track width and
length, etc.
It is also important to pay special attention to the following tasks:
●
The ground plane should be used as a shield below the device
●
The power supply planes must be designed around the device towards the other
components, as shown in Figure 3, Figure 4 and Figure 5. The purpose is to separate
the current flow supplying the rest of the application from the CPU power supply plane
●
Every supply pin should be decoupled by a ceramic capacitor. The capacitor should be
placed as close as possible to the supply pin and connected to VSS with a path as short
as possible.
STM8S and STM8AF devices require an additional external capacitor for a voltage regulator
connected through the VCAP pin:
●
The correct value of the capacitor is very critical (a min. 470 nF capacitance must be
kept in any condition)
●
The capacitor should be placed as close as possible to VCAP pin and with the shortest
ground plane.
Warning:
Special care must be taken on the device EMC robustness
when the application requires the use of an external (HSE)
oscillator (for instance, for permanent asynchronous
communication or time-dependent measuring) and the
internal clock source cannot be used.
A potential risk of EMC robustness degradation can be
minimized by applying the rules described below.
●
The ground path between the capacitor-loaded resonator and VSS must be as short as
possible.
●
It is better to use a resonator with a metal cap which should be connected to VSS
whenever possible.
●
An additional shielding structure should surround the area of the crystal resonator and
of the associated components (see Figure 3, Figure 4 and Figure 5).



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