PACKAGE OUTLINE DIMENSIONS

Min

Max

Min

Max

A

2.70

3.10

0.106

0.122

B

1.10

1.50

0.043

0.059

C

0.30

0.51

0.012

0.020

D

1.78

2.04

0.070

0.080

E

2.10

2.64

0.083

0.104

F

0.89

1.30

0.035

0.051

G

H

SUGGEST PAD LAYOUT

Z

X

Y

C

E

Note: 1. The suggested land pattern dimensions have been provided for reference only, as actual pad layouts

may vary depending on application.

Document Number: DS_S1501018

Version: C15

1.0

0.039

0.7

0.028

0.9

0.035

1.9

0.075

DIM.

Unit (mm)

Unit (inch)

Typ.

Typ.

2.8

0.110

DIM.

Unit (mm)

Unit (inch)

0.55 REF

0.022 REF

0.10 REF

0.004 REF

TESDF5V0A

Taiwan Semiconductor

Small Signal Product

ORDER INFORMATION (EXAMPLE)

SOT-23

TESDF5V0A RFG

Green compound code

Packing code

Part no.