LTM2882

21

2882ff

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

revision hisTory

REV

DATE

DESCRIPTION

PAGE NUMBER

A

3/10

Changes to Features

Add BGA Package to Pin Configuration, Order Information and Package Description Sections

Changes to LGA Package in Pin Configuration Section

Update to Pin Functions

Update to RF, Magnetic Field Immunity Section

“PCB Layout Isolation Considerations” Section Replaced

1

2, 15

2

9

12

13

B

3/11

H-Grade parts added. Reflected throughout the data sheet.

1-20

C

1/12

MP-Grade parts added. Reflected throughout the data sheet.

1-24

D

11/12

Storage temperature range updated.

2

E

5/14

Removed H-grade and MP-grade parts throughout the data sheet.

Reduced Maximum Internal Operating Temperature and Storage Temperature Range.

Added CTI and DTI parameters.

1-22

2

5

F

9/14

3