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2DA1774QLP Datasheet(PDF) 2 Page - Diodes Incorporated |
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2DA1774QLP Datasheet(HTML) 2 Page - Diodes Incorporated |
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2 / 5 page ![]() 2DA1774QLP Document number: DS31438 Rev. 5 - 2 2 of 5 www.diodes.com May 2015 © Diodes Incorporated 2DA1774QLP Absolute Maximum Ratings (@TA = +25°C unless otherwise specified.) Characteristic Symbol Value Unit Collector-Base Voltage VCBO -50 V Collector-Emitter Voltage VCEO -40 V Emitter-Base Voltage VEBO -5.0 V Collector Current IC -100 mA Peak Collector Current ICM -200 mA Thermal Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Unit Power Dissipation (Note 5) PD 400 mW (Note 6) 1,000 Thermal Resistance, Junction to Ambient (Note 5) RJA 310 °C/W (Note 6) 120 Thermal Resistance, Junction to Lead (Note 7) RJL 120 °C/W Operating and Storage and Temperature Range TJ, TSTG -55 to +150 °C ESD Ratings (Note 8) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine Model ESD MM 200 V B Electrical Characteristics (@TA = +25°C unless otherwise specified.) Characteristic Symbol Min Max Unit Test Condition OFF CHARACTERISTICS (Note 9) Collector-Base Breakdown Voltage BVCBO -50 V IC = -50µA, IE = 0 Collector-Emitter Breakdown Voltage BVCEO -40 V IC = -1mA, IB = 0 Emitter-Base Breakdown Voltage BVEBO -5.0 V IE = -50 µA, IC = 0 Collector Cutoff Current ICBO -100 -5 nA A VCB = -30V VCB = -30V, TA = +150°C Emitter Cutoff Current IEBO -100 nA VEB = -4.0V ON CHARACTERISTICS (Note 9) DC Current Gain hFE 120 270 VCE = -6.0V, IC = -1.0mA Collector-Emitter Saturation Voltage VCE(SAT) -0.2 V IC = -50mA, IB = -5.0mA SMALL SIGNAL CHARACTERISTICS Output Capacitance Cobo 5.0 pF VCB = -12V, f = 1.0MHz, IE = 0 Current Gain-Bandwidth Product fT 100 MHz VCE = -12V, IC = -2.0mA, f = 100MHz Notes: 5. For the device mounted on minimum recommended pad layout 1oz copper that is on a single-sided 1.6mm FR4 PCB; device is measured under still air conditions whilst operating in steady state condition. The entire exposed collector pad is attached to the heatsink. 6. Same as Note 5, except the exposed collector pad is mounted on 25mm x 25mm 2oz copper. 7. Thermal resistance from junction to solder-point (on the exposed collector pad). 8. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 9. Measured under pulsed conditions. Pulse width ≤ 300µs. Duty cycle ≤ 2%. |
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