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DP0150ALP4 Datasheet(PDF) 2 Page - Diodes Incorporated |
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DP0150ALP4 Datasheet(HTML) 2 Page - Diodes Incorporated |
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2 / 5 page ![]() DP0150ALP4 / DP0150BLP4 Document number: DS31493 Rev. 7 - 2 2 of 5 www.diodes.com May 2015 © Diodes Incorporated DP0150ALP4 / DP0150BLP4 Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Unit Collector-Base Voltage VCBO -50 V Collector-Emitter Voltage VCEO -50 V Emitter-Base Voltage VEBO -5 V Collector Current - Continuous IC -100 mA Peak Pulse Collector Current ICM -200 mA Base Current IB -30 mA Thermal Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Unit Power Dissipation (Note 5) PD 400 mW (Note 6) 1000 Thermal Resistance, Junction to Ambient (Note 5) RJA 310 °C/W (Note 6) 120 Thermal Resistance, Junction to Lead (Note 7) RJL 120 °C/W Operating and Storage and Temperature Range TJ, TSTG -55 to +150 °C ESD Ratings (Note 8) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine Model ESD MM 400 V C Electrical Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Min Typ Max Unit Test Condition OFF CHARACTERISTICS Collector-Base Breakdown Voltage BVCBO -50 — — V IC = -10μA, IE = 0 Collector-Emitter Breakdown Voltage (Note 8) BVCEO -50 — — V IC = -1mA, IB = 0 Emitter-Base Breakdown Voltage BVEBO -5 — — V IE = -10μA, IC = 0 Collector Cut-Off Current ICBO — — -0.1 μA VCB = -50V, IE = 0 Emitter Cut-Off Current IEBO — — -0.1 μA VEB = -5V, IC = 0 ON CHARACTERISTICS (Note 9) Collector-Emitter Saturation Voltage VCE(SAT) — -0.15 -0.3 V IC = -100mA, IB = -10mA DC Current Gain DP01510ALP4 DP01510BLP4 hFE 120 — 240 — VCE = -6V, IC = -2mA 200 — 400 SMALL SIGNAL CHARACTERISTICS Transition Frequency fT 80 — — MHz VCE = -10V, IE = 1mA f = 30MHz Output Capacitance Cob — 1.6 — pF VCB = -10V, IE = 0, f = 1MHz Notes: 5. For the device mounted on minimum recommended pad layout 1oz copper that is on a single-sided 1.6mm FR4 PCB; device is measured under still air conditions whilst operating in steady state condition. The entire exposed collector pad is attached to the heatsink. 6. Same as Note 5, except the exposed collector pad is mounted on 25mm x 25mm 2oz copper. 7. Thermal resistance from junction to solder-point (on the exposed collector pad). 8. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 9. Measured under pulsed conditions. Pulse width 300µs. Duty cycle 2%. |
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