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DMN6066SSS-13 Datasheet(PDF) 2 Page - Diodes Incorporated |
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DMN6066SSS-13 Datasheet(HTML) 2 Page - Diodes Incorporated |
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2 / 9 page ![]() DMN6066SSS Document Number DS33047 Rev. 3 - 2 2 of 9 www.diodes.com April 2015 © Diodes Incorporated DMN6066SSS Maximum Ratings (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Unit Drain-Source Voltage VDSS 60 V Gate-Source Voltage (Note 6) VGS ± 20 V Single Pulsed Avalanche Energy (Note 11) EAS 37.5 mJ Single Pulsed Avalanche Current (Note 11) IAS 5.0 A Continuous Drain Current VGS = 10V (Note 8) ID 5.0 A TA = +70°C (Note 8) 4.0 (Note 7) 3.7 Pulsed Drain Current VGS = 10V (Note 9) IDM 23 A Continuous Source Current (Body diode) (Note 8) IS 4.0 A Pulsed Source Current (Body diode) (Note 9) ISM 23 A Thermal Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Unit Power Dissipation Linear Derating Factor (Note 7) PD 1.56 12.5 W mW/°C (Note 8) 2.81 22.5 Thermal Resistance, Junction to Ambient (Note 7) RθJA 80.0 °C/W (Note 8) 44.5 Thermal Resistance, Junction to Lead (Note 10) RθJL 37.0 Operating and Storage Temperature Range TJ, TSTG -55 to 150 °C Notes: 6. AEC-Q101 VGS maximum is ±16V. 7. For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is measured when operating in a steady-state condition. 8. Same as note (7), except the device is measured at t ≤ 10 sec. 9. Same as note (7), except the device is pulsed with D= 0.02 and pulse width 300 µs. The pulse current is limited by the maximum junction temperature. 10. Thermal resistance from junction to solder-point (at the end of the drain lead). 11. UIS in production with L = 3.0mH, IAS = 5.0A, RG = 25 , VDD=50V, starting TJ = +25°C. |
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