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DMN6066SSS-13 Datasheet(PDF) 2 Page - Diodes Incorporated

Part # DMN6066SSS-13
Description  60V N-CHANNEL ENHANCEMENT MODE MOSFET
PDF  9 Pages
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Manufacturer  DIODES [Diodes Incorporated]
Direct Link  http://www.diodes.com
Logo DIODES - Diodes Incorporated

DMN6066SSS-13 Datasheet(HTML) 2 Page - Diodes Incorporated

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DMN6066SSS
Document Number DS33047 Rev. 3 - 2
2 of 9
www.diodes.com
April 2015
© Diodes Incorporated
DMN6066SSS
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Unit
Drain-Source Voltage
VDSS
60
V
Gate-Source Voltage
(Note 6)
VGS
±
20
V
Single Pulsed Avalanche Energy
(Note 11)
EAS
37.5
mJ
Single Pulsed Avalanche Current
(Note 11)
IAS
5.0
A
Continuous Drain Current
VGS = 10V
(Note 8)
ID
5.0
A
TA = +70°C (Note 8)
4.0
(Note 7)
3.7
Pulsed Drain Current
VGS = 10V
(Note 9)
IDM
23
A
Continuous Source Current (Body diode)
(Note 8)
IS
4.0
A
Pulsed Source Current (Body diode)
(Note 9)
ISM
23
A
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Unit
Power Dissipation
Linear Derating Factor
(Note 7)
PD
1.56
12.5
W
mW/°C
(Note 8)
2.81
22.5
Thermal Resistance, Junction to Ambient
(Note 7)
RθJA
80.0
°C/W
(Note 8)
44.5
Thermal Resistance, Junction to Lead
(Note 10)
RθJL
37.0
Operating and Storage Temperature Range
TJ, TSTG
-55 to 150
°C
Notes:
6. AEC-Q101 VGS maximum is ±16V.
7. For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is
measured when operating in a steady-state condition.
8. Same as note (7), except the device is measured at t ≤ 10 sec.
9. Same as note (7), except the device is pulsed with D= 0.02 and pulse width 300 µs. The pulse current is limited by the maximum junction temperature.
10. Thermal resistance from junction to solder-point (at the end of the drain lead).
11. UIS in production with L = 3.0mH, IAS = 5.0A, RG = 25 , VDD=50V, starting TJ = +25°C.



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