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F7313 Datasheet(PDF) 1 Page - International Rectifier |
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F7313 Datasheet(HTML) 1 Page - International Rectifier |
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1 / 7 page  HEXFET® Power MOSFET PD - 95039 Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications. The SO-8 has been modified through a customized leadframe for enhanced thermal characteristics and multiple-die capability making it ideal in a variety of powerapplications. Withtheseimprovements,multiple devices can be used in an application with dramatically reduced board space. The package is designed for vapor phase, infra red, or wave soldering techniques. 10/7/04 SO-8 VDSS = 30V RDS(on) = 0.029Ω IRF7313PbF Description Symbol Maximum Units Drain-Source Voltage VDS 30 Gate-Source Voltage VGS ± 20 TA = 25°C 6.5 TA = 70°C 5.2 Pulsed Drain Current IDM 30 Continuous Source Current (Diode Conduction) IS 2.5 TA = 25°C 2.0 TA = 70°C 1.3 Single Pulse Avalanche Energy EAS 82 mJ Avalanche Current IAR 4.0 A Repetitive Avalanche Energy EAR 0.20 mJ Peak Diode Recovery dv/dt dv/dt 5.8 V/ ns Junction and Storage Temperature Range TJ,TSTG -55 to + 150 °C Thermal Resistance Ratings Parameter Symbol Limit Units Maximum Junction-to-Ambient RθJA 62.5 °C/W Absolute Maximum Ratings ( TA = 25°C Unless Otherwise Noted) Continuous Drain Current Maximum Power Dissipation A ID PD V W D1 D1 D2 D2 G1 S2 G2 S1 Top View 8 1 2 3 4 5 6 7 l Generation V Technology l Ultra Low On-Resistance l Dual N-Channel MOSFET l Surface Mount l Fully Avalanche Rated l Lead-Free |
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