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PUSB3FR4 Datasheet(PDF) 7 Page - NXP Semiconductors

Part # PUSB3FR4
Description  ESD protection for ultra high-speed interfaces
PDF  15 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

PUSB3FR4 Datasheet(HTML) 7 Page - NXP Semiconductors

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PUSB3FR4
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 1 — 26 January 2015
7 of 15
NXP Semiconductors
PUSB3FR4
ESD protection for ultra high-speed interfaces
The device uses an advanced clamping structure showing a negative dynamic resistance.
This snap-back behavior strongly reduces the clamping voltage to the system behind the
ESD protection during an ESD event. Do not connect unlimited DC current sources to the
data lines to avoid keeping the ESD protection device in snap-back state after exceeding
breakdown voltage (due to an ESD pulse for instance).
tp = 100 ns; Transmission Line Pulse (TLP)
tp = 100 ns; Transmission Line Pulse (TLP)
Fig 9.
Dynamic resistance with positive clamping;
typical values
Fig 10. Dynamic resistance with negative clamping;
typical values
tp = 5 ns; Transmission Line Pulse (TLP)
tp = 5 ns; Transmission Line Pulse (TLP)
Fig 11. Dynamic resistance with positive clamping;
typical values
Fig 12. Dynamic resistance with negative clamping;
typical values
VCL (V)
030
20
10
aaa-016322
10
20
30
IPP
(A)
0
VCL (V)
-30
0
-10
-20
aaa-016323
-20
-10
0
IPP
(A)
-30
VCL (V)
020
15
510
aaa-016324
10
5
15
20
IPP
(A)
0
VCL (V)
-12
0
-4
-8
aaa-016325
-8
-4
0
IPP
(A)
-12



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