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Material Content Data Sheet

Sales Product Name

BSC024NE2LS

Issued

14. August 2015

MA#

MA001015214

Package

PG-TDSON-8-6

Weight*

118.18 mg

Construction Element

Material Group

Substances

CAS#

if applicable

Weight

[mg]

Average

Mass

[%]

Sum

[%]

Average

Mass

[ppm]

Sum

[ppm]

chip

inorganic material

silicon

7440-21-3

0.393

0.33

0.33

3322

3322

leadframe

non noble metal

iron

7439-89-6

0.038

0.03

320

inorganic material

phosphorus

7723-14-0

0.011

0.01

96

non noble metal

copper

7440-50-8

37.762

31.96

32.00

319521

319937

wire

noble metal

gold

7440-57-5

0.046

0.04

0.04

385

385

encapsulation

organic material

carbon black

1333-86-4

0.088

0.07

745

plastics

epoxy resin

-

6.251

5.29

52894

inorganic material

silicondioxide

60676-86-0

37.683

31.89

37.25

318854

372493

leadfinish

non noble metal

tin

7440-31-5

1.470

1.24

1.24

12437

12437

plating

noble metal

silver

7440-22-4

0.166

0.14

0.14

1401

1401

solder

noble metal

silver

7440-22-4

0.016

0.01

131

non noble metal

tin

7440-31-5

0.012

0.01

105

non noble metal

lead

7439-92-1

0.592

0.50

0.52

5012

5248

heatspreader

non noble metal

iron

7439-89-6

0.011

0.01

96

inorganic material

phosphorus

7723-14-0

0.003

0.00

29

non noble metal

copper

7440-50-8

11.320

9.58

9.59

95785

95910

heat sink CLIP

non noble metal

iron

7439-89-6

0.022

0.02

189

inorganic material

phosphorus

7723-14-0

0.007

0.01

57

non noble metal

copper

7440-50-8

22.292

18.86

18.89

188621

188867

*deviation

< 10%

Sum in total:

100.00

1000000

Important Remarks:

Infineon Technologies AG provides full material declaration based on information provided by third parties and

has taken and continues to take reasonable steps to provide representative and accurate information.

Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be

proprietary, and thus CAS numbers and other limited information may not be available for release.

All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any

time due to technical requirements and development without notification.

This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption

7a, Lead in high melting temperature type solders.

Company

Infineon Technologies AG

Address

81726 München

Internet

www.infineon.com