LM2936HVBMAX3.3SLASHNOPB datasheet(4/34 Pages) TI

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LM2936

SNOSC48O – JUNE 2000 – REVISED DECEMBER 2014

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6 Specifications

6.1 Absolute Maximum Ratings

(1) (2)

MIN

MAX

UNIT

Input voltage (survival)

−50

Power dissipation (3)

Internally limited

Junction temperature (TJMAX)

150

°C

Storage temperature, Tstg

−65

150

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not

apply when operating the device beyond its specified operating ratings.

(2)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.

(3)

The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX) − TA) / RθJA. If this dissipation is exceeded, the die temperature can rise above the TJ(MAX) of 150°C, and

the LM2936 may go into thermal shutdown.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. .

6.3 Recommended Operating Conditions

MIN

MAX

UNIT

Temperature, TJ

−40

125

°C

Input voltage, VIN , LM2936

5.5

Input voltage, VIN , LM2936HV only

5.5

Shutdown pin voltage, VSD, LM2936BM only

6.4 Thermal Information

LM2936

SOIC (D)

TO-252

VSSOP

SOT-223

TO-92 (LP)

THERMAL METRIC(1)

UNIT

(NDP)

(DGK)

(DCY)

8 PINS

3 PINS

8 PINS

4 PINS

3 PINS

RθJA

Junction-to-ambient thermal resistance

111.4

50.5

173.4

62.8

156.8

RθJC(top)

Junction-to-case (top) thermal resistance

56.3

52.6

65.9

44.2

80.4

RθJB

Junction-to-board thermal resistance

51.9

29.7

94.9

11.7

n/a

°C/W

ψJT

Junction-to-top characterization parameter

10.9

4.8

9.6

3.6

24.5

ψJB

Junction-to-board characterization parameter

51.4

29.3

93.3

11.6

136.0

RθJC(bot)

Junction-to-case (bottom) thermal resistance

n/a

1.6

n/a

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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