LM2623AMMSLASHNOPB datasheet(4/22 Pages) TI

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LM2623

SNVS188H – MAY 2004 – REVISED NOVEMBER 2014

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6 Specifications

6.1 Absolute Maximum Ratings

(1) (2)

MIN

MAX

UNIT

SW pin voltage

–0.5

14.5

BOOT, VDD, EN and FB pins

–0.5

FREQ pin

100

µA

TJmax

(3)

150

°C

Lead temp. (soldering, 5 sec)

260

°C

Power dissipation (TA=25°C)

(3)

500

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

The maximum power dissipation must be derated at elevated temperatures and is dictated by Tjmax (maximum junction temperature),

RθJA (junction-to-ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any

temperature is Pdmax = (Tjmax – TA)/ RθJA or the number given in the Absolute Maximum Ratings, whichever is lower.

6.2 Handling Ratings

MIN

MAX

UNIT

Tstg

Storage temperature range

–65

150

°C

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

pins(1)

V(ESD)

Electrostatic discharge

Charged device model (CDM), per JEDEC specification

0.5

JESD22-C101, all pins(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

(1)

MIN

MAX

UNIT

VDD pin

FB, EN pins

VDD

BOOT pin

Ambient temperature (TA)

−40

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.4 Thermal Information

LM2623

THERMAL METRIC(1)

NHE

DGK

UNIT

14 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

40 – 56

240

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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