RFM219SW

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Rev 1.0 | Page 4/35

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1. Electrical Characteristics

impedance, with the BER of 0.1%. All measurements are performed using the board RFM219SW-EM V1.0, unless

otherwise noted.

1.1 Recommended Operation Conditions

Table 2. Recommended Operation Conditions

Parameter

Symbol

Conditions

Min

Typ

Max

Unit

Operation Voltage Supply

1.8

3.6

V

Operation Temperature

-40

85

℃

Supply Voltage Slew Rate

1

mV/us

1.2 Absolute Maximum Ratings

Table 3. Absolute Maximum Ratings

[1]

Parameter

Symbol

Conditions

Min

Max

Unit

Supply Voltage

-0.3

3.6

V

Interface Voltage

-0.3

V

Junction Temperature

-40

125

℃

Storage Temperature

-50

150

℃

Soldering Temperature

Lasts at least 30 seconds

255

℃

ESD Rating

[2]

Human Body Model (HBM)

-2

2

kV

Latch-up Current

@ 85 ℃

-100

100

mA

Notes:

[1]. Stresses above those listed as “absolute maximum ratings” may cause permanent damage to the device. This is a stress

rating only and functional operation of the device under these conditions is not implied. Exposure to maximum rating

conditions for extended periods may affect device reliability.

[2]. The RFM219SW is high-performance RF integrated circuits with VCON/P pins having an ESD rating < 2 kV HBM.

Handling and assembly of this device should only be done at ESD-protected workstations.

Caution! ESD sensitive device. Precaution should be used when handling the device in order

to prevent permanent damage.