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UTT8P03G-K08-3020-R Datasheet(PDF) 3 Page - Unisonic Technologies |
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UTT8P03G-K08-3020-R Datasheet(HTML) 3 Page - Unisonic Technologies |
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3 / 8 page ![]() UTT8P03-H Power MOSFET UNISONICTECHNOLOGIESCO.,LTD 3 of 8 www.unisonic.com.tw QW-R210-006.A ELECTRICAL CHARACTERISTICS (TJ=25°C, unless otherwise noted) PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNIT OFF CHARACTERISTICS Drain-Source Breakdown Voltage BVDSS ID=-250µA, VGS=0V -30 V Drain-Source Leakage Current IDSS VDS=-30V, VGS=0V -1 µA VDS=-30V, VGS=0V, TJ=55°C -5 µA Gate-Source Leakage Current Forward IGSS VGS=+20V, VDS=0V +10 uA Reverse VGS=-20V, VDS=0V -10 uA ON CHARACTERISTICS Gate Threshold Voltage VGS(TH) VDS=VGS, ID=-250µA -0.8 -1.3 -1.8 V Static Drain-Source On-State Resistance RDS(ON) VGS=-10V, ID=-8A 21 26 mΩ VGS=-4.5V, ID=-7A 27 34 mΩ On State Drain Current ID(ON) VGS=-10V, VDS=-5V -60 A DYNAMIC PARAMETERS Input Capacitance CISS VGS=0V, VDS=-15V, f=1.0MHz 930 pF Output Capacitance COSS 170 pF Reverse Transfer Capacitance CRSS 120 pF Gate Resistance RG VGS=0V, VDS=0V, f=1MHz 8 Ω SWITCHING PARAMETERS (Note 2) Total Gate Charge QG VGS=-4.5V, VDS=-15V, ID=-5A 11 17 nC Gate to Source Charge QGS 3.4 nC Gate to Drain Charge QGD 4.2 nC Turn-ON Delay Time tD(ON) VDS=-1 5V, VGS=-10V, RGEN=6Ω, ID=-1A 5.8 11 ns Rise Time tR 18.8 36 ns Turn-OFF Delay Time tD(OFF) 46.9 90 ns Fall-Time tF 12.3 23 ns SOURCE- DRAIN DIODE RATINGS AND CHARACTERISTICS Maximum Body-Diode Continuous Current IS -8.5 A Maximum Body-Diode Pulsed Current ISm -17 A Drain-Source Diode Forward Voltage VSD IS=-1A, VGS=0V -0.74 -1 V Notes: 1. The value of θJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C. The value in any given application depends on the user's specific board design. 2. The power dissipation PD is based on TJ(MAX)=150°C, using ≤10s junction-to-ambient thermal resistance. 3. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep initial TJ=25°C 4. The θJA is the sum of the thermal impedance from junction to lead θJL and lead to ambient 5. The static characteristics in Figures 1 to 6 are obtained using <300us pulses, duty cycle 0.5% max 6. These curves are based on the junction-to-ambient thermal impedance which is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, assuming a maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse rating. |
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