TPS61253, TPS61254, TPS61256, TPS61258, TPS61259

SLVSAG8E – SEPTEMBER 2011 – REVISED MARCH 2015

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12.3 Thermal Considerations

Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires

special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added

heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-

dissipation limits of a given component.

Three basic approaches for enhancing thermal performance are listed below:

•

Improving the power dissipation capability of the PCB design

•

Improving the thermal coupling of the component to the PCB

•

Introducing airflow in the system

As power demand in portable designs is more and more important, designers must figure the best trade-off

between efficiency, power dissipation and solution size. Due to integration and miniaturization, junction

temperature can increase significantly which could lead to bad application behaviors (i.e. premature thermal

shutdown or worst case reduce device reliability).

Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where

high maximum power dissipation exists (e.g. TPS61253 or TPS61259 based solutions), special care must be

below 125°C.

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