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CSTCC2M00G53093-R0

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CSTCC2M00G53093-R0

Appearance & Shape

Applications

Other Usage

Consumer/Industrial

Packaging Information

Packaging

Specifications

Minimum

Order Quantity

-R0

180mm Embossed Tape

2000

Features

MURATA's package technology expertise has enabled the

development of the Chip CERALOCK(R) with built-in load

capacitors. High-density mounting can be realized because of the

small package and the elimination of the need for an external load

capacitor.

Features

1. Oscillation circuits do not require external load capacitors.

2. Available in a wide frequency range.

3. Extremely small and have a low profile.

4. No adjustment is necessary for oscillation circuits.

1 of 3

Atten ti o n

1.T his datasheet is downloaded from the website of Murata Manufacturing Co., Ltd. T herefore, it’s specifications are subject to change or our products in it may be discontinued

without advance notice. Please check with our sales representatives or product engineers before ordering.

2.T his datasheet has only typical specifications because there is no space for detailed specifications.

T herefore, please review our product specifications or consult the approval sheet for product specifications before ordering.

URL : http://www.murata.com/

Last

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updated 2015/11/19