LX1686CPW datasheet(2/5 Pages) MICROSEMI

2 / 5 page

D IGITAL D IMMING CCFL C ONTROLLER IC

LX1686

PRODUCT DA T ABOOK 1996/1997

Rev. 0.4 1/00

RangeMAXTM

P RELIMINAR Y D ATA S HEET

ELECTRICAL CHARACTERISTICS

(Unless otherwise specified, these specifications apply over the recommended operating conditions of T

A = 0 to 85°C, VDD=VDD_P= 3.0 to 5.5V)

(Ri = 40k

Ω, C

VCO= 0.01µF, CAFD= 0.22µF, CTRI= 0.83µF, CRAMP= 208pF, RRAMP = 15kΩ, CPD= 0.22µF, CPDC= 0.047µF, RPD= 110kΩ.)

Power Supply Voltage

VDD

VDD = VDD_P

Operating Current

IDD

VDD = VDD_P = 5V

Power Supply Voltage

VDD_P

VDD = VDD_P

Output Buffer Operating Current

IDD_P

Volsns = VDD = VDD_P = 5V, CA = CB = 1000pF

UVLO Threshold

VTH_UVLO

UVLO Hysteresis

VH_UVLO

Parameter

Symbol

Test Conditions

Units

LX1686

Min.

Typ.

Max.

35.5

210

2.7

2.9

160

Direct Drive Ramp Block

Triangular Wave Generator Analog Output Peak Voltage

VP_TRI

Triangular Wave Generator Analog Output Valley Voltage

VV_TRI

Triangular Wave Generator Oscillation Frequency

F_TRI

Triangular Wave Generator Oscillation Charge Current

ICHG_TRI

Tri_c = 0V

Triangular Wave Generator Oscillation Discharge Current

IDISCHG_TRI

Tri_c = 3V

Ramp Generator Analog Output Peak Voltage

VP_RAMP

Ramp Generator Analog Output Valley Voltage

VV_RAMP

Ramp Frequency Change Threshold

VTH_RAMP_R

VDD = 3V

VDD = 5.5V

Ramp Generator Oscillation Frequency - Nominal

FRAMP

VTRI_C = 1.4V

Ramp Generator Oscillation Frequency - Maximum

FRAMP_HI

VTRI_C = 2.25V

OLSNS Threshold Voltage

VTH_OLSNS

VDD = 3V

OLSNS Hysteresis

VH_OLSNS

VDD = 3V

OLSNS-to-ICOMP Propagation Delay

TD_OLSNS

GBD

2.25

0.75

-2.3

-2.55

-2.9

µA

2.3

2.65

2.9

µA

2.25

0.75

1.4

1.5

1.65

1.55

1.65

1.8

100

116

KHz

170

200

256

KHz

250

300

360

1µS

Supply Voltage (VDD, VDD_P) ......................................................................... 6.5V

Digital Inputs .................................................................................. -0.3 to VDD+0.5V

Analog Inputs .................................................................................. -0.3 to VDD+0.5V

Digital Outputs ................................................................................ -0.3 to VDD+0.5V

Analog Outputs ............................................................................... -0.3 to VDD+0.5V

Operating Junction Temperature

Plastic (DB, PW Packages) .......................................................................... 150°C

Storage Temperature Range .............................................................. -65°C to 150°C

Lead Temperature (Soldering, 10 seconds) .................................................... 300°C

Note 1. Exceeding these ratings could cause damage to the device. All voltages are with

respect to Ground. Currents are positive into, negative out of the specified

terminal.

PW PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

100°C/W

Junction Temperature Calculation: T

J = TA + (PD x θJA).

The

JA numbers are guidelines for the thermal performance of the device/pc-board

system. All of the above assume no ambient airflow.

THERMAL DATA

ABSOLUTE MAXIMUM RATINGS

(Note 1)

PACKAGE PIN OUTS

PW PACKAGE

(Top View)

BOUT

VDD_P

VDD

TRI_C

OLSNS

ISNS

ICOMP

VSNS

VCOMP

BRT

I_R

ENABLE

223

322

421

520

619

718

817

916

AOUT

VSS_P

VSS

AFD_C

RAMP_C

RAMP_R

FVERT

PD_CR

VCO_C

BRT_POS

BRITE

DIG_DIM

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