LX8610-33CDM datasheet(2/6 Pages) MICROSEMI

2 / 6 page

Microsemi

Linfinity Microelectronics Division

11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570

Page 2

Rev. 0.6f,2000-09-15

LX8610-xx

1A BiCMOS Very Low Dropout Regulators

PRELIMINARY DATASHEET

M I CROSEM I

COM P A N Y

GN D

OU T

T AB IS G N D

ST PACKAGE

(Top View)

OUT

EN ABLE

AD J

GN D /

H E AT SIN K

GN D /

H E AT SIN K

GN D /

H E AT SIN K

GN D /

H E AT SIN K

DM PACKAGE

(Top View)

PLASTIC SOT-223 PACKAGE

THERMAL RESISTANCE-JUNCTION TO TAB,

°C/W*

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

150

°C/W

DM PLASTIC SOIC PACKAGE

THERMAL RESISTANCE

-JUNCTION TO AMBIENT,

JLD

30°C/W

THERMAL RESISTANCE

-JUNCTION TO AMBIENT,

90°C/W

Junction Temperature Calculation: TJ = TA + (PD x θJA).

The

JA numbers are guidelines for the thermal performance of the device/pc-board

system. All of the above assume no ambient airflow.

JA can be improved with package soldered copper area over backside ground plane or

internal power plane

JA can vary from 45°C/W > 75°C/W depending on mounting

technique. See table below for thermal resistance guidelines:

Copper Area

(Topside)*

Copper Area

(Backside)*

Board Area

Thermal

Resistance

(

JA)

ST (SOT-223)

2.0 sq” (1290mm

1.0 sq” (645 mm

2.0 sq” (1290mm

45°C/W

1.0 sq” (645 mm

0.5 sq” (323 mm

1.0 sq” (645 mm

50°C/W

0.5 sq” (323 mm

0.1 sq” (65 mm

0.5 sq” (323 mm

60°C/W

0.25 sq” (161 mm

0.1 sq” (65 mm

0.25 sq” (161 mm

70°C/W

DM (SOIC)

2.0 sq” (1290mm

1.0 sq” (645 mm

2.0 sq” (1290mm

60°C/W

1.0 sq” (645 mm

0.5 sq” (323 mm

1.0 sq” (645 mm

67°C/W

0.5 sq” (323 mm

0.1 sq” (65 mm

0.5 sq” (323 mm

70°C/W

0.25 sq” (161 mm

0.1 sq” (65 mm

0.25 sq” (161 mm

75°C/W

*Tab of device attached to topside copper, or leads 2,3,5,6 of SOIC package

Possible Heat Sink Approaches

using PCB Copper

Input Voltage (VIN) ......................................................................................................6.5V

Enable Pin ..............................................................................................-0.3V to VIN+0.3V

Operating Junction Temperature Plastic (ST & DM) Packages .................................125°C

Storage Temperature ................................................................................... -65°C to 150°C

Lead Temperature (Soldering, 10 Seconds) ...............................................................300°C

Note:

Exceeding these ratings could cause damage to the device. All voltages are with respect to

Ground. Currents are positive into, negative out of specified terminal.

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