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MMDF2P01HD Datasheet(PDF) 2 Page - ON Semiconductor

Part # MMDF2P01HD
Description  P?묬hannel SO??, Dual Power MOSFET
PDF  12 Pages
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

MMDF2P01HD Datasheet(HTML) 2 Page - ON Semiconductor

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MMDF2P01HD
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ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted) (Note 3.)
Characteristic
Symbol
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Drain−Source Breakdown Voltage
(VGS = 0 Vdc, ID = 250 µAdc)
Temperature Coefficient (Positive)
V(BR)DSS
12
−
−
17
−
−
Vdc
mV/
°C
Zero Gate Voltage Drain Current
(VDS = 12 Vdc, VGS = 0 Vdc)
(VDS = 12 Vdc, VGS = 0 Vdc, TJ = 125°C)
IDSS
−
−
−
−
1.0
10
µAdc
Gate−Body Leakage Current (VGS = ± 8.0 Vdc, VDS = 0)
IGSS
−
−
100
nAdc
ON CHARACTERISTICS (Note 4.)
Gate Threshold Voltage
(VDS = VGS, ID = 250 µAdc)
Temperature Coefficient (Negative)
VGS(th)
0.7
−
1.0
3.0
1.1
−
Vdc
mV/
°C
Static Drain−to−Source On−Resistance
(VGS = 4.5 Vdc, ID = 2.0 Adc)
(VGS = 2.7 Vdc, ID = 1.0 Adc)
RDS(on)
−
−
0.16
0.2
0.180
0.220
Ohm
Forward Transconductance (VDS = 2.5 Vdc, ID = 1.0 Adc)
gFS
3.0
4.75
−
mhos
DYNAMIC CHARACTERISTICS
Input Capacitance
(V
10 Vd
V
0Vd
Ciss
−
530
740
pF
Output Capacitance
(VDS = 10 Vdc, VGS = 0 Vdc,
f = 1.0 MHz)
Coss
−
410
570
Reverse Transfer Capacitance
f = 1.0 MHz)
Crss
−
177
250
SWITCHING CHARACTERISTICS (Note 5.)
Turn−On Delay Time
td(on)
−
21
45
ns
Rise Time
(VDD = 6.0 Vdc, ID = 2.0 Adc,
VGS =27Vdc
tr
−
156
315
Turn−Off Delay Time
VGS = 2.7 Vdc,
RG = 6.0 Ω)
td(off)
−
38
75
Fall Time
RG 6.0 Ω)
tf
−
68
135
Turn−On Delay Time
td(on)
−
16
35
Rise Time
(VDS = 6.0 Vdc, ID = 2.0 Adc,
VGS =45Vdc
tr
−
44
90
Turn−Off Delay Time
VGS = 4.5 Vdc,
RG = 6.0 Ω)
td(off)
−
68
135
Fall Time
RG 6.0 Ω)
tf
−
54
110
Gate Charge
QT
−
9.3
13
nC
(VDS = 10 Vdc, ID = 2.0 Adc,
Q1
−
0.8
−
(VDS
10 Vdc, ID
2.0 Adc,
VGS = 4.5 Vdc)
Q2
−
4.0
−
Q3
−
3.0
−
SOURCE−DRAIN DIODE CHARACTERISTICS
Forward On−Voltage (Note 4.)
(IS = 2.0 Adc, VGS = 0 Vdc)
(IS = 2.0 Adc, VGS = 0 Vdc, TJ = 125°C)
VSD
−
−
1.69
1.2
2.0
−
Vdc
Reverse Recovery Time
t
48
ns
Reverse Recovery Time
trr
−
48
−
ns
(IS = 2.0 Adc, VGS = 0 Vdc,
ta
−
23
−
(IS
2.0 Adc, VGS
0 Vdc,
dIS/dt = 100 A/µs)
tb
−
25
−
Reverse Recovery Stored Charge
QRR
−
0.05
−
µC
3. Negative sign for P−Channel device omitted for clarity.
4. Pulse Test: Pulse Width
≤ 300 µs, Duty Cycle ≤ 2%.
5. Switching characteristics are independent of operating junction temperature.



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