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DMN67D8L Datasheet(PDF) 2 Page - Diodes Incorporated |
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DMN67D8L Datasheet(HTML) 2 Page - Diodes Incorporated |
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2 / 6 page ![]() DMN67D8L Document number: DS38024 Rev. 1 - 2 2 of 6 www.diodes.com September 2015 © Diodes Incorporated DMN67D8L Maximum Ratings (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Unit Drain-Source Voltage VDSS 60 V Gate-Source Voltage VGSS ±30 V Continuous Drain Current (Note 6) VGS = 10V Steady State TA = +25°C TA = +85°C ID 210 150 mA Maximum Body Diode Forward Current (Note 6) IS 500 mA Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%) IDM 800 mA Thermal Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Unit Total Power Dissipation (Note 5) PD 340 mW Thermal Resistance, Junction to Ambient (Note 5) Steady State RθJA 376 °C/W Total Power Dissipation (Note 6) PD 570 mW Thermal Resistance, Junction to Ambient (Note 6) Steady State RθJA 224 °C/W Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C Electrical Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Min Typ Max Unit Test Condition OFF CHARACTERISTICS (Note 7) Drain-Source Breakdown Voltage BVDSS 60 V VGS = 0V, ID = 10µA Zero Gate Voltage Drain Current IDSS 1.0 µA VDS = 60V, VGS = 0V Gate-Source Leakage IGSS ±100 nA VGS = ±20V, VDS = 0V ON CHARACTERISTICS (Note 7) Gate Threshold Voltage VGS(TH) 1.0 2.5 V VDS = VGS, ID = 250µA Static Drain-Source On-Resistance RDS(ON) 3.2 1.5 7.5 5.0 VGS = 5.0V, ID = 0.05A VGS = 10V, ID = 0.5A Forward Transconductance gFS 80 mS VDS =10V, ID = 0.2A Diode Forward Voltage VSD 0.78 1.5 V VGS = 0V, IS = 115mA DYNAMIC CHARACTERISTICS (Note 8) Input Capacitance Ciss 22 pF VDS = 25V, VGS = 0V, f = 1.0MHz Output Capacitance Coss 4.1 pF Reverse Transfer Capacitance Crss 2.5 pF Gate Resistance Rg 120 VDS = 0V, VGS = 0V, f = 1.0MHz Total Gate Charge (VGS = 4.5V) Qg 361 pC VDS = 10V, ID = 250mA Total Gate Charge (VGS = 10V) Qg 821 Gate-Source Charge Qgs 162 Gate-Drain Charge Qgd 116 Turn-On Delay Time tD(ON) 2.8 ns VDD = 30V, ID = 0.2A, RL = 150, VGEN = 10V, RGEN = 25 Turn-On Rise Time tR 3.0 Turn-Off Delay Time tD(OFF) 7.6 Turn-Off Fall Time tF 5.6 Notes: 5. Device mounted on FR-4 PCB, with minimum recommended pad layout. 6. Device mounted on 1” x 1” FR-4 PCB with high coverage 2oz. Copper, single sided. 7. Short duration pulse test used to minimize self-heating effect. 8. Guaranteed by design. Not subject to product testing. |
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