LAMINATE

Data Sheet

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DS831C

Rev Date: 9/15

Cross-section FCBGA

Additional Package Options

• Wafer Node -≥ 28 nm qualified, 20 nm in development

• SMT components on top or bottom side

• Multi-die capability

• Memory components on top side

• Variety of lid material options

• Grounded lid

• Custom BGA footprints

Test Services

• Program generation/conversion

• Product engineering

• Available test/handling technology

• Burn-in capabilities

Shipping

• Standard JEDEC trays

FCBGA

Lidded FCBGA

Bare Die FCBGA

Configuration Options

Full Array Ball Counts (Ball Count Shown Indicates Maximum Package Size Produced to Date)

Body

Size

0.4 mm

0.5 mm

0.65 mm

0.8 mm

1 mm

Body

Size

0.4 mm

0.5 mm

0.65 mm

0.8 mm

1 mm

Ball Count Ball Count Ball Count Ball Count Ball Count

Ball Count Ball Count Ball Count Ball Count Ball Count

10

576

361

196

121

81

31

1369

900

11

676

441

256

144

100

33

1600

1024

12

841

529

289

196

121

35

1764

1156

13

961

625

361

225

144

37.5

2025

1296

14

1156

729

400

256

169

40

1521

15

1296

841

484

289

196

42.5

1681

16

1521

961

529

361

225

45

1936

17

625

400

256

47.5

2116

19

784

484

324

50

2401

21

961

625

400

52.5

2601

23

1156

729

484

55

2916

25

1369

900

576

57.5

3136

27

1024

676

60

3481

29

1225

784

65

4096