SDM1A40CSP datasheet(2/5 Pages) DIODES

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SDM1A40CSP

Document number: DS38446 Rev. 3 - 2

2 of 5

www.diodes.com

January 2016

SDM1A40CSP

Maximum Ratings (@TA = +25°C, unless otherwise specified.)

Single phase, half wave, 60Hz, resistive or inductive load.

For capacitance load, derate current by 20%.

Characteristic

Symbol

Value

Unit

Peak Repetitive Reverse Voltage

VRRM

Average Rectified Output Current

Repetitive peak Forward Current

(Pulse Wave = 1 msec, Duty Cycle = 25%)

IFRM

Non-Repetitive Peak Forward Surge Current 8.3ms

Single Half Sine-Wave Superimposed on Rated Load

IFSM

Thermal Characteristics

Characteristic

Symbol

Value

Unit

Typical Thermal Resistance Junction to Ambient (Note 5)

RθJA

135

°C/W

Typical Thermal Resistance Junction to Ambient (Note 6)

RθJA

°C/W

Operating and Storage Temperature Range

TJ, TSTG

-55 to +150

°C

Electrical Characteristics (@TA = +25°C, unless otherwise specified.)

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

Forward Voltage Drop



0.41

0.46

IF = 0.5A, TJ = +25°C



0.51

0.56

IF = 1.0A, TJ = +25°C



0.49



IF = 1.0A, TJ = +125°C

Leakage Current (Note 7)



µA

VR = 10V, TJ = +25°C



VR = 40V, TJ = +25°C



9.5



VR = 40V, TJ = +125°C

Junction Capacitance



VR = 4V, f = 1.0MHz

Notes:

5. Device mounted on FR-4 PCB, 2oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.

6. Device mounted on FR-4 PCB, 2oz. 1 square inch Copper.

7. Short duration pulse test used to minimize self-heating effect.

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