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STF9N60M2 Datasheet(PDF) 3 Page - STMicroelectronics |
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STF9N60M2 Datasheet(HTML) 3 Page - STMicroelectronics |
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3 / 15 page ![]() DocID024728 Rev 2 3/15 STF9N60M2, STFI9N60M2 Electrical ratings 15 1 Electrical ratings Table 2. Absolute maximum ratings Symbol Parameter Value Unit VGS Gate-source voltage ± 25 V ID Drain current (continuous) at TC = 25 °C 5.5(1) 1. Pulse width limited by safe operating area. A ID Drain current (continuous) at TC = 100 °C 3.6(1) A IDM (1) Drain current (pulsed) 22(1) A PTOT Total dissipation at TC = 25 °C 20 W VISO Insulation withstand voltage (RMS) from all three leads to external heat sink (t=1 s; TC=25 °C) 2500 V dv/dt (2) 2. ISD ≤ 5.5 A, di/dt ≤ 400 A/µs; VDS peak < V(BR)DSS, VDD=400 V Peak diode recovery voltage slope 15 V/ns dv/dt(3) 3. VDS ≤ 480 V MOSFET dv/dt ruggedness 50 Tstg Storage temperature - 55 to 150 °C Tj Max. operating junction temperature 150 Table 3. Thermal data Symbol Parameter Value Unit Rthj-case Thermal resistance junction-case max 6.25 °C/W Rthj-amb Thermal resistance junction-ambient max 62.5 °C/W Table 4. Avalanche characteristics Symbol Parameter Value Unit IAR Avalanche current, repetitive or not repetitive (pulse width limited by Tjmax) 2A EAS Single pulse avalanche energy (starting Tj=25°C, ID= IAR; VDD=50) 105 mJ |
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