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SPT01-335DEE Datasheet(PDF) 12 Page - STMicroelectronics |
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SPT01-335DEE Datasheet(HTML) 12 Page - STMicroelectronics |
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12 / 16 page ![]() Recommendation on PCB assembly SPT01-335DEE 12/16 DocID15200 Rev3 7 Recommendation on PCB assembly 7.1 Stencil opening design 1. General recommendation on stencil opening design a) Stencil opening dimensions: L (Length), W (Width), T (Thickness). Figure 15. Stencil opening dimensions b) General design rule Stencil thickness (T) = 75 ~ 125 µm 2. Reference design a) Stencil opening thickness: 100 µm b) Stencil opening for central exposed pad: Opening to footprint ratio is 50%. c) Stencil opening for leads: Opening to footprint ratio is 90%. Figure 16. Recommended stencil window position L T W Aspect Ratio W T ----- 1,5 ≥ = Aspect Area LW × 2T L W + () ---------------------------- 0,66 ≥ = 0.3 0.354 0.329 0.014 0.011 0.379 0.95 1.70 1.202 0.5 0.073 0.044 0.4 0.32 0.53 0.20 0.032 2.249 0.141 0.503 |
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