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VD5377CBSW Datasheet(PDF) 12 Page - STMicroelectronics |
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VD5377CBSW Datasheet(HTML) 12 Page - STMicroelectronics |
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12 / 88 page  Silicon specification VD5377 12/88 Doc ID 022952 Rev 2 2.5 Bond pad coordinates All dimensions are in microns. Bond pad coordinates correspond to the bond pad centers referenced to the die center. Table 6. Bond pad coordinates Pad # Pad name X co-ordinate Y co-ordinate 1 DVSS -827.6 792.7 2 I2C_SEL0 -827.6 515.6 3 I2C_SEL1 -827.6 378.0 4 I2C_SEL2 -827.6 240.3 5 LED_OUT -827.6 102.6 6 DVSS -827.6 -35.0 7 DVDD -827.6 -218.8 8 BACKLED0 -827.6 -356.4 9 BACKLED1 -827.6 -494.1 10 BACKLED2 -827.6 -631.8 11 DVSS -649.8 -810.1 12 DVDD -511.4 -810.1 13 POWERDOWN -317.5 -810.1 14 POR_TEST -213.8 -810.1 15 VTOP -110.1 -810.1 16 STANDBY 28.3 -810.1 17 DVREG 470.1 -810.1 18 DVSS 649.6 -810.1 19 GPIO0 827.6 -632.3 20 MOTION 827.6 -484.3 21 DVSS 827.6 -336.1 22 TEST_CLK 827.6 -187.5 23 SDA 827.6 -10.3 24 SCL 827.6 145.4 25 AVSS 827.6 556.0 26 AVDD 827.6 733.4 |
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