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VD5377CBGP Datasheet(PDF) 10 Page - STMicroelectronics |
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VD5377CBGP Datasheet(HTML) 10 Page - STMicroelectronics |
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10 / 88 page  Silicon specification VD5377 10/88 Doc ID 022952 Rev 2 2 Silicon specification This chapter contains physical die information. 2.1 Silicon thickness Standard silicon thickness is 180 µm (see Table 40: Delivery formats on page 86). 2.2 Die size and optical center All dimensions and all coordinates are referenced to the origin at die center. 2.3 Pad opening sizes Minimum bond pad pitch: 138 µm. Table 3. Die size Conditions X size (µm) Y size (µm) Including seal 1794 1758 Including scribe (step and repeat) 1894 1858 Table 4. Optical center Parameter X (µm) Y (µm) Die center 0 0 Array center -83 +447 Table 5. Pad openings X (µm) Y (µm) Size 86.4 86.4 |
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