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54F373DM Datasheet(PDF) 4 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part # 54F373DM
Description  Octal Transparent Latch with TRI-STATE Outputs
PDF  8 Pages
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

54F373DM Datasheet(HTML) 4 Page - National Semiconductor (TI)

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AC Electrical Characteristics
74F
54F
74F
TA ea25 C
TA VCC e Mil
TA VCC e Com
Symbol
Parameter
VCC ea50V
CL e 50 pF
CL e 50 pF
Units
CL e 50 pF
Min
Typ
Max
Min
Max
Min
Max
tPLH
Propagation Delay
30
53
70
30
85
30
80
ns
tPHL
Dn to On
20
37
50
20
70
20
60
tPLH
Propagation Delay
50
90
115
50
150
50
130
ns
tPHL
LE to On
30
52
70
30
85
30
80
tPZH
Output Enable Time
20
50
110
20
135
20
120
ns
tPZL
20
56
75
20
100
20
85
tPHZ
Output Disable Time
15
45
65
15
100
15
75
ns
tPLZ
15
38
50
15
70
15
60
AC Operating Requirements
74F
54F
74F
Symbol
Parameter
TA ea25 C
TA VCC e Mil
TA VCC e Com
Units
VCC ea50V
Min
Max
Min
Max
Min
Max
ts(H)
Setup Time HIGH or LOW
20
20
20
ts(L)
Dn to LE
20
20
20
ns
th(H)
Hold Time HIGH or LOW
30
30
30
th(L)
Dn to LE
30
40
30
tw(H)
LE Pulse Width HIGH
60
60
60
ns
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows
74F
373
S
C
X
Temperature Range Family
Special Variations
74FeCommercial
QB e Military grade device with
54FeMilitary
environmental and burn-in
processing
Device Type
X e Devices shipped in 13 reel
Package Code
Temperature Range
P e Plastic DIP
CeCommercial (0 Cto a70 C)
D e Ceramic DIP
MeMilitary (b55 Cto a125 C)
F e Flatpak
NOTE
L e Leadless Chip Carrier (LCC)
Not required for MSA package code
S e Small Outline SOIC JEDEC
SJ e Small Outline SOIC EIAJ
MSA e Shrink Small Outline (EIAJ SSOP)
4



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