7

CGH40180PP Rev 3.0

Cree, Inc.

4600 Silicon Drive

Durham, North Carolina, USA 27703

USA Tel: +1.919.313.5300

Fax: +1.919.869.CREE

Fax: +1.919.869.2733

www.cree.com/rf

Copyright © 2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are

registered trademarks of Cree, Inc.

Thermal Resistance as a Function of Pulse Width

Note 1: This heating curve assumes zero power dissipation during the “off” portion of the duty cycle.

Note 2: This data is for transient power dissipation at 224 W, Duty Cycle = 20 %.

Simulated Source and Load Impedances

Frequency (MHz)

Z Source

Z Load

500

2.85 + j1.99

5.27 + j0.68

1000

0.8 + j0.42

4.91 + j0.36

1500

0.84 - j1.69

4.65 - j0.24

2000

0.88 - j3.05

2.8 - j1.05

2500

1.08 - j4.5

3.1 - j2.47

3000

1.25 - j6.06

3.1 - j4.01

Note 1. V

Note 2. Optimized for power gain, P

Note 3. When using this device at low frequency, series resistors should be used to

maintain amplifier stability.

D1

Z Source 1

Z Load 1

G1

S

G2

Z Source 2

Z Load 2

D2

0.6

0.7

0.8

0.9

1.0

Heating Curve for 2x28.8mm GaN HEMT in 440199 Package at 4W/mm

0.0

0.1

0.2

0.3

0.4

0.5

1.00E-08

1.00E-07

1.00E-06

1.00E-05

1.00E-04

1.00E-03

1.00E-02

1.00E-01

1.00E+00

Time (seconds)