UT8SF2M40 datasheet(9/23 Pages) AEROFLEX

9 / 23 page

36-00-01-00

Ver. 1.0.0

Aeroflex Microelectronics Solutions - HiRel

ABSOLUTE MAXIMUM RATINGS1

(Referenced to VSS)

Notes:

1. Permanent device damage may occur if absolute maximum ratings are exceeded. Functional operation should be restricted to recommended operating conditions.

2. All voltages are referenced to VSS.

3. Per MIL-STD-883, Method 1012, Section 3.4.1 PD = (TJ(max) - TC(max))

OPERATIONAL ENVIRONMENTS

Notes:

1. Adams 90% worst case environment, Geosynchronous orbit, 100mils of aluminum

2. Temperature = 105oC; VDD and VDDQ = 3.6V

RECOMMENDED OPERATING CONDITIONS

SYMBOL

PARAMETER

VALUE

UNIT

VDD/VDDQ

Supply Voltage2

-0.5 to 4.0

VIN

Voltage on any pin2

-0.3 to VDDQ+0.3

IIO

DC I/O current per pin @ TJ = 135o for 15 years

+10

Package power dissipation permitted @ TC = 105°C3

Maximum junction temperature

+150

ΘJC

Thermal resistance junction to case

oC/W

TSTG

Storage temperature

-65 to +150

PARAMETER

LIMIT

UNITS

Total Ionizing Dose (TID)

100

krad(Si)

Heavy Ion Error Rate 1

1.7x10-6

Errors/Bit-Day

Single Event Latchup (SEL) Immune2

≤ 100

MeV-cm2/mg

SYMBOL

PARAMETER

LIMITS

VDD

Core supply voltage

2.3V to VDDQ

VDDQ

I/O power supply voltage

2.3V to 3.6V

Case temperature range

-55

°C to +105°C

VIN

DC input voltage

0V to VDDQ

Junction Temperature

-55

°C to +125°C

ΘJC

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