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QW-JB062

SMD Schottky Barrier Rectifiers

REV:A

Comchip Technology CO., LTD.

Comchip

S M D D i o d e S p e c i a l i s t

Company reserves the right to improve product design , functions and reliability without notice.

Reverse Voltage: 40 Volts

Forward Current: 3.0 Amp

RoHS Device

CDBAS340-HF

Dimensions in inches and (millimeter)

SMA-S

0.191(4.85)

0.173(4.40)

0.108(2.75)

0.096(2.45)

0.043(1.10)

Max.

0.043(1.10)

Mechanical data

- Built-in strain relief

- Metal silicon junction with guard ring

Halogen Free

Features

- Silicon epitaxial planar chips

- Case: Molded plastic, SMA-S

- Terminals: Solder plated solderable per

MIL-STD-750 method 2026

- Polarity: Color band denotes cathode end

- Epoxy: UL94-V0 rate flame retardant

Circuit diagram

Typ.

- Weight: 0.045 grams(approx.)

- For use in low voltage, high frequency invertors

free wheeling and polarity protection

- High surge and current capability

0.045(1.15)

Typ.

0.153(3.90)

0.132(3.35)

- Mounting position: Any

Notes: 1. Pulse test: 300µS pulse width,1% duty cycle

Maximum recurrent peak reverse voltage

Maximum DC blocking voltage

Maximum RMS voltage

Peak forward surge current

8.3ms single half sine-wave superimposed

on rate load (JEDEC method)

Maximum DC reverse current

at rated DC blocking voltage

Operating junction temperature range

Storage temperature range

Value

Unit

Symbol

Parameter

40

40

28

80

3.0

20

55

-55 to +125

-55 to +150

V

V

V

A

A

mA

°C/W

°C

°C

Maximum forward voltage at 3.0A (note1)

V

0.50

2. Measured at 1.0MHz and applied reverse voltage of 4.0 volts

Junction to lead

Junction to Ambient

17

°C/W

T =25°C

A

0.1

250

P

F

Typical junction capacitance (note2)

Typical thermal resistance (note3)

Maximum average forward current

0.2 x0.2” 5.0x5.0mm) copper pad area, see Figure 1

(

3. Thermal resistance from junction to ambient and from junction to lead P.C.B. mounted on 0.2x0.2”(5.0x5.0mm) copper pad areas.

0.057(1.45)

0.051(1.30)