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CDBMHT340-HF Datasheet(PDF) 1 Page - Comchip Technology

Part # CDBMHT340-HF
Description  SMD Schottky Barrier Rectifiers
PDF  4 Pages
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Manufacturer  COMCHIP [Comchip Technology]
Direct Link  http://www.comchiptech.com
Logo COMCHIP - Comchip Technology

CDBMHT340-HF Datasheet(HTML) 1 Page - Comchip Technology

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Reverse Voltage: 40 to 100 Volts
Forward Current: 3.0 Amp
RoHS Device
CDBMHT340-HF Thru. CDBMHT3100-HF
Page 1
QW-JB056
SMD Schottky Barrier Rectifiers
REV:A
Comchip Technology CO., LTD.
Parameter
Symbol
Unit
Repetitive peak reverse voltage
Continuous reverse voltage
RMS voltage
Max. Forward rectified current
Maximum forward voltage at IF=3.0A
Max. Forward surge current, 8.3ms single
half sine-wave superimposed on rated
load (JEDEC method)
Max. Reverse current
VR=VRRM TJ=25°C
Thermal resistance
Typ. Diode junction capacitance (Note 1)
VRRM
VR
VRMS
IO
VF
IFSM
IR
RθJA
CJ
TJ
CDBMH
T340-HF
CDBMH
T360-HF
CDBMH
T3100-HF
40
40
28
60
60
42
3.0
0.70
50
0.2
10
70
100
100
70
V
V
V
A
V
A
mA
°C/W
°C
0.55
0.85
Operating temperature
Storage temperature range
TSTG
-65 to +175
°C
-55 to +125
-55 to +150
160
pF
1. F=1MHz and applied 4V DC reverse voltage
Note :
VR=VRRM TJ=100°C
IR
Mechanical data
- Case: Molded plastic, SOD-123HT/Mini SMA.
- Terminals: Solderable per MIL-STD-750, method 2026.
- Polarity: Indicated by cathode band.
- Weight: 0.011 grams approx.
- Mounting Position : Any.
- Epoxy : UL94-V0 rated flame retardant.
Dimensions in inches and (millimeter)
SOD-123HT
0.146(3.70)
0.130(3.30)
0.012(0.30) Typ.
0.071(1.80)
0.055(1.40)
0.039(1.00)
0.024(0.60)
0.031(0.80) Typ.
0.031(0.10) Typ.
Halogen Free
Electrical Characteristics (at TA=25°C unless otherwise noted)
Features
- Low power loss, high efficiency.
- High current capability, low forward voltage drop.
- High surge capability.
- Guard ring for overvoltage protection.
- Ultra high-speed switching.
- Silicon epitaxial planar chip, metal silicon junction.
- Lead-free parts meet environmental standards of
MIL-STD-19500/228
better reverse
- Excellent power dissipation offers
leakage current and thermal resistance.
- Low profile package is 40% thinner than standards
SOD-123.
- Heat sink bottom.
0.083(2.10)
0.075(1.90)
0.024(0.6) Typ.
0.051(1.30)
0.043(1.10)
0.031(0.80)
0.024(0.60)
0.047(1.20)
0.039(1.00)
0.033(0.85)
0.030(0.75)
0.047(1.20)
0.039(1.00)
RθJC
35
°C/W
Junction to ambient
Junction to case
Company reserves the right to improve product design , functions and reliability without notice.


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