NJW4170

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Ver.2016-01-25

POWER DISSIPATION vs. AMBIENT TEMPERATURE

(*5): Mounted on glass epoxy board. (76.2×114.3×1.6mm:based on EIA/JDEC standard size, 2Layers, Cu area 100mm

(*6): Mounted on glass epoxy board. (76.2×114.3×1.6mm:based on EIA/JDEC standard, 4Layers)

(For 4Layers: Applying 74.2×74.2mm inner Cu area and a thermal via hall to a board based on JEDEC standard JESD51-5)

(*7): Mounted on glass epoxy board. (101.5 114.5 1.6mm: based on EIA/JEDEC standard, 2Layers FR-4, with Exposed Pad)

(*8): Mounted on glass epoxy board. (101.5 114.5 1.6mm: based on EIA/JEDEC standard, 4Layers FR-4, with Exposed Pad)

(For 4Layers: Applying 99.5 99.5mm inner Cu area and a thermal via hole to a board based on JEDEC standard JESD51-5)

TYPICALAPPLICATIONS

SW

GND

IN-

NJW4170

EN/

SYNC

R2

L

SBD

R1

EN/SYNC

High: ON

Low: OFF

(Standby)

0

500

1000

1500

2000

2500

3000

-50

-25

0

25

50

75

100

125

150

Ambient Temperature Ta (°C)

NJW4170U2 (SOT89-5 Package)

Power Dissipation vs. Ambient Temperature

(Tj=~150°C)

At on 4 layer PC Board (*6)

At on 2 layer PC Board (*5)

0

500

1000

1500

2000

2500

3000

-50

-25

0

25

50

75

100

125

150

Ambient Temperature Ta (°C)

NJW4170KV1 (DFN8-V1 Package)

Power Dissipation vs. Ambient Temperature

(Tj=~150°C)

At on 4 layer PC Board (*8)

At on 2 layer PC Board (*7)