MICROWAVE CORPORATION

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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order Online at www.hittite.com

8

HMC415LP3

GaAs InGaP HBT MMIC

POWER AMPLIFIER, 4.9 - 5.9 GHz

v02.0604

Evaluation PCB

The circuit board used in the final application should use RF

circuit design techniques. Signal lines should have 50 ohm

impedance while the package ground leads and exposed

paddle should be connected directly to the ground plane

similar to that shown. A sufficient number of VIA holes

should be used to connect the top and bottom ground

planes. The evaluation board should be mounted to an

appropriate heat sink. The evaluation circuit board shown is

available from Hittite upon request.

List of Material

Item

Description

J1 - J2

PC Mount SMA RF Connector

J3

2 mm DC Header

C1 - C3

330 pF Capacitor, 0603 Pkg.

C4

2.2 µF Capacitor, Tantalum

C5

0.5 pF Capacitor, 0603 Pkg.

C6

7.0 pF Capacitor, 0402 Pkg.

L1

3.0 nH Inductor, 0805 Pkg.

U1

HMC415LP3 Amplifier

PCB*

104723 Eval Board

* Circuit Board Material: Rogers 4350