Io = 100mA

CDBN001A

Features

Designed for mounting on small surface

Extremely thin package

Low stored charge

Majority carrier conduction

Mechanical data

Case: 1206(3216) Standard package,

molded plastic

Terminals: Solder plated, solderable per

MIL-STD-750, method 2026

Polarity: Indicated by cathode band

Mounting position: Any

Weight: 0.0085 gram (approximately)

SMD Schottky Barrier Diode

SMD Schottky Barrier Diode

www.comchip.com.tw

COMCHIP

COMCHIP

Page 1

0.126(3.20)

0.118(3.00)

0.020(0.50) Typ.

0.063(1.60)

0.055(1.40)

0.043 (1.10)

0.035(0.90)

0.010(R0.25)Typ.

0.063(1.60)

0.055(1.40)

0.043 (1.10)

0.035(0.90)

Dimensions in inches and (millimeter)

1206 (3216)

Parameter

Repetitive peak reverse voltage

Average forward current

Forward current , surge peak

Capacitance between terminals

Power Dissipation

Storage temperature

Junction temperature

Conditions

Symbol

T j

Min

-40

-40

Max

30

100

6

300

+125

+125

Unit

V

V

V

V

V

uA

Typ

1000

Parameter

Forward voltage 1

Forward voltage 2

Forward voltage 3

Forward voltage 4

Forward voltage 5

Reverse current

Conditions

IF = 0.1 mA DC

IF = 1 mA D C

IF = 10 m A DC

IF = 30 m A DC

IF = 100 mA DC

Symbol

Min Typ Max

0.24

0.32

0.40

0.50

1.00

2

Unit

C

C

8.3 ms single half sine-wave superimposed

on rate load ( JEDEC method )

V

mA

mA

pF

mW

Symbol

T j

Electrical Characteristics ( at TA = 25 C unless otherwise noted )

RDS0208018-C