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TDA8926 Datasheet(PDF) 26 Page - NXP Semiconductors |
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TDA8926 Datasheet(HTML) 26 Page - NXP Semiconductors |
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26 / 32 page ![]() 2002 Oct 10 26 Philips Semiconductors Preliminary specification Power stage 2 × 50 W class-D audio amplifier TDA8926 16 PACKAGE OUTLINE REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ DIMENSIONS (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. SOT243-1 0 5 10 mm scale D L E A c A2 L 3 Q w M b p 1 d D Z e e x h 117 j Eh non-concave 97-12-16 99-12-17 DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) SOT243-1 view B: mounting base side m 2 e v M B UNIT A e 1 A2 bp cD(1) E(1) Z (1) de Dh LL3 m mm 17.0 15.5 4.6 4.4 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 2.54 v 0.8 12.2 11.8 1.27 e 2 5.08 2.4 1.6 Eh 6 2.00 1.45 2.1 1.8 3.4 3.1 4.3 12.4 11.0 Q j 0.4 w 0.03 x |
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