MAX17541G datasheet(2/17 Pages) MAXIM

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MAX17541G

42V, 500mA, Ultra-Small, High-Efficiency,

Synchronous Step-Down DC-DC Converter

www.maximintegrated.com

Maxim Integrated │ 2

Electrical Characteristics

(VIN = 24V, VGND = VPGND = 0V, CVIN=1μF,CVCC=1μF,VEN = 1.5V, CSS = 3300pF, VFB = 0.98 x VOUT,LX=unconnected,RESET

= unconnected. TA = TJ = -40°C to +125°C, unless otherwise noted. Typical values are at TA = +25°C. All voltages are referenced to

GND, unless otherwise noted.) (Note 2)

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to

www.maximintegrated.com/thermal-tutorial.

VIN to GND.............................................................-0.3V to +48V

EN/UVLOtoGND.......................................-0.3V to (VIN + 0.3V)

LXtoPGND................................................-0.3V to (VIN + 0.3V)

FB, RESET, COMP, SS to GND .............................-0.3V to +6V

VCC to GND..............................................................-0.3V to +6V

GND to PGND.......................................................-0.3V to +0.3V

LXTotalRMSCurrent.........................................................±1.6A

Output Short-Circuit Duration.....................................Continuous

OperatingTemperatureRange.........................-40°Cto+125°C

Junction Temperature......................................................+150°C

StorageTemperatureRange.............................-65°Cto+160°C

LeadTemperature(soldering,10s).................................+300°C

Soldering Temperature (reflow).......................................+260°C

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Thermal Characteristics (Note 1)

10 TDFN

Continuous Power Dissipation (TA = +70°C)

(derate 14.9mW/°C above +70°C) (multilayer board).1188.7mW

Junction-to-AmbientThermalResistance(θJA) ...........67.3°C/W

Junction-to-CaseThermalResistance(θJC)................18.2°C/W

Absolute Maximum Ratings

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

INPUT SUPPLY (VIN)

InputVoltageRange

VIN

4.5

Input Supply Current

IIN-SH

VEN = 0V, shutdown mode

0.9

3.5

µA

IIN-SW

Normal switching mode, no load

4.75

6.75

ENABLE/UVLO (EN/UVLO)

EN Threshold

VENR

VEN rising

1.194

1.218

1.236

VENF

VEN falling

1.114

1.135

1.156

VEN-TRUESD VEN falling, true shutdown

0.7

ENInputLeakageCurrent

IEN

VEN = VIN = 42V, TA = +25°C

200

LDO

VCCOutputVoltageRange

VCC

6V < VIN < 12V, 0mA < IVCC < 10mA,

12V < VIN < 42V, 0mA < IVCC < 2mA

4.65

5.35

VCCCurrentLimit

IVCC-MAX

VCC = 4.3V, VIN = 12V

VCC Dropout

VCC-DO

VIN = 4.5V, IVCC = 5mA

4.1

VCCUVLO

VCC-UVR

VCC rising

3.85

4.15

VCC-UVF

VCC falling

3.55

3.7

3.85

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