S6E2C2 datasheet(73/207 Pages) CYPRESS

73 / 207 page

Document Number: 002-05030 Rev.*A

Page 73 of 207

S6E2C2 Series

Surface Mount Type

Surface mount packaging has longer and thinner leads than lead-insertion packaging, and therefore leads are more easily deformed

or bent. The use of packages with higher pin counts and narrower pin pitch results in increased susceptibility to open connections

caused by deformed pins, or shorting due to solder bridges.

You must use appropriate mounting techniques. Cypress recommends the solder reflow method, and has established a ranking of

mounting conditions for each product. Users are advised to mount packages in accordance with Cypress ranking of recommended

conditions.

Lead-Free Packaging

CAUTION: When ball grid array (BGA) packages with Sn-Ag-Cu balls are mounted using Sn-Pb eutectic soldering, junction strength

may be reduced under some conditions of use.

Storage of Semiconductor Devices

Because plastic chip packages are formed from plastic resins, exposure to natural environmental conditions will cause absorption of

moisture. During mounting, the application of heat to a package that has absorbed moisture can cause surfaces to peel, reducing

moisture resistance and causing packages to crack. To prevent this, do the following:

1. Avoid exposure to rapid temperature changes, which can cause moisture to condense inside the product. Store products in

locations where temperature changes are slight.

2. Use dry boxes for product storage. Products should be stored below 70% relative humidity, and at temperatures between 5°C

and 30°C.

3. When Dry Packages are opened, it is recommended to have humidity between 40% and 70%.

4. When necessary, Cypress packages semiconductor devices in highly moisture-resistant aluminum laminate bags, with a silica

gel desiccant. Devices should be sealed in these aluminum laminate bags for storage.

5. Avoid storing packages where they are exposed to corrosive gases or high levels of dust.

Baking

Packages that have absorbed moisture may be de-moisturized by baking (heat drying). Follow the Cypress recommended

conditions for baking.

Condition: 125°C/24 h

Static Electricity

Because semiconductor devices are particularly susceptible to damage by static electricity, you must take the following precautions:

1. Maintain relative humidity in the working environment between 40% and 70%. Use of an apparatus for ion generation may be

needed to remove electricity.

2. Electrically ground all conveyors, solder vessels, soldering irons, and peripheral equipment.

3. Eliminate static body electricity by the use of rings or bracelets connected to ground through high resistance (on the level of 1

Ω). Wearing of conductive clothing and shoes, and the use of conductive floor mats and other measures to minimize shock

loads is recommended.

4. Ground all fixtures and instruments, or protect with anti-static measures.

5. Avoid the use of Styrofoam or other highly static-prone materials for storage of completed board assemblies.

S6E2C2 Datasheet(PDF) 73 Page - Cypress Semiconductor