MCRF200 datasheet(13/24 Pages) MICROCHIP

13 / 24 page

 2003 Microchip Technology Inc.

DS21219H-page 13

MCRF200

6.0

FAILED DIE IDENTIFICATION

Every die on the wafer is electrically tested according

to the data sheet specifications and visually inspected

to detect any mechanical damage such as mechanical

cracks and scratches.

Any failed die in the test or visual inspection is identified

by black colored ink. Therefore, any die covered with

black ink should not be used.

The ink dot specification:

• Ink dot size: minimum 20

µm x 20 µm

• Position: central third of die

• Color: black

7.0

WAFER DELIVERY

DOCUMENTATION

Each wafer container is marked with the following

information:

• Microchip Technology Inc. MP Code

• Lot Number

• Total number of wafers in the container

• Total number of good dice in the container

• Average die per wafer (DPW)

• Scribe number of wafers with number of good

dice

8.0

NOTICE ON DIE AND WAFER

HANDLING

The device is

very

susceptible to Electrostatic

Discharge (ESD). ESD can cause critical damage to

the device. Special attention is needed during the

handling process.

Any untraviolet (UV) light can erase the memory cell

contents of an unpackaged device. Flourescent lights

and sun light can also erase the memory cell although

it takes more time than UV lamps. Therefore, keep any

unpackaged devices out of UV light and also avoid

direct exposure from strong flourescent lights and sun

light.

Certain integrated circuit (IC) manufacturing, chip-on-

board (COB) and tag assembly operations may use UV

light. Operations such as backgrind, de-tape, certain

cleaning operations, epoxy or glue cure should be done

without exposing the die surface to UV light.

Using x-ray for die inspection will not harm the die, nor

erase memory cell contents.

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