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DLP2010

DLPS046B – JULY 2014 – REVISED JULY 2016

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Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 3

6

Specifications......................................................... 6

6.1

Absolute Maximum Ratings ...................................... 6

6.2

Storage Conditions.................................................... 6

6.3

ESD Ratings.............................................................. 7

6.4

Recommended Operating Conditions ....................... 7

6.5

Thermal Information .................................................. 9

6.6

Electrical Characteristics........................................... 9

6.7

Timing Requirements .............................................. 11

6.8

Switching Characteristics ........................................ 16

6.9

System Mounting Interface Loads .......................... 16

6.10

Physical Characteristics of the Micromirror Array . 17

6.11

Micromirror Array Optical Characteristics ............ 18

6.12

Window Characteristics......................................... 19

6.13

Chipset Component Usage Specification ............. 19

7

Detailed Description ............................................ 20

7.1

Overview ................................................................. 20

7.2

Functional Block Diagram ....................................... 20

7.3

Feature Description................................................. 21

7.4

Device Functional Modes........................................ 21

7.5

Window Characteristics and Optics ........................ 21

7.6

Micromirror Array Temperature Calculation............ 22

7.7

Micromirror Landed-On/Landed-Off Duty Cycle .... 23

8

Application and Implementation ........................ 27

8.1

Application Information............................................ 27

8.2

Typical Application .................................................. 27

9

Power Supply Recommendations ...................... 29

9.1

Power Supply Power-Up Procedure ...................... 29

9.2

Power Supply Power-Down Procedure .................. 29

9.3

Power Supply Sequencing Requirements .............. 30

10

Layout................................................................... 32

10.1

Layout Guidelines ................................................. 32

10.2

Layout Example .................................................... 32

11

Device and Documentation Support ................. 34

11.1

Device Support...................................................... 34

11.2

Related Links ........................................................ 34

11.3

Trademarks ........................................................... 34

11.4

Electrostatic Discharge Caution ............................ 34

11.5

Glossary ................................................................ 34

12

Mechanical, Packaging, and Orderable

Information ........................................................... 35

4 Revision History

Changes from Revision A (April 2015) to Revision B

Page

•

Changed Vreset Max voltage in Absolute Maximum Ratings

(1) to match Figure 22 which had the correct value ................ 6

•

•

Added device name to Thermal Information to follow datasheet standards .......................................................................... 9

•

Changed Micromirror tilt angle tolerance to ±1.4° in Micromirror Array Optical Characteristics ......................................... 18

•

Changed Micromirror crossover and switching time specifications in Micromirror Array Optical Characteristics to

match actual operation ......................................................................................................................................................... 18

•

Added Pre-charge values to MAX in Table 3 ....................................................................................................................... 31

Changes from Original (July 2014) to Revision A

Page

•

All VSS pins changed from Power to GND. ........................................................................................................................... 4

•

Added Storage Conditions table............................................................................................................................................. 6

•

Updated the VID spec to align with .3 720p. .......................................................................................................................... 7

•

Lowered minimum delay time .............................................................................................................................................. 31