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DMP3036SFG Datasheet(PDF) 2 Page - Diodes Incorporated

Part # DMP3036SFG
Description  30V P-CHANNEL ENHANCEMENT MODE MOSFET
PDF  6 Pages
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Manufacturer  DIODES [Diodes Incorporated]
Direct Link  http://www.diodes.com
Logo DIODES - Diodes Incorporated

DMP3036SFG Datasheet(HTML) 2 Page - Diodes Incorporated

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POWERDI is a registered trademark of Diodes Incorporated
DMP3036SFG
Document number: DS37038 Rev. 4 - 2
2 of 6
www.diodes.com
January 2015
© Diodes Incorporated
DMP3036SFG
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Units
Drain-Source Voltage
VDSS
-30
V
Gate-Source Voltage
VGSS
±25
V
Continuous Drain Current (Note 6) VGS = -10V
Steady
State
TA = +25°C
TA = +70°C
ID
-8.7
-7.0
A
t<10s
TA = +25°C
TA = +70°C
ID
-12.7
-10.1
A
Continuous Drain Current (Note 6) VGS = -5V
Steady
State
TA = +25°C
TA = +70°C
ID
-7.2
-5.8
A
t<10s
TA = +25°C
TA = +70°C
ID
-10.5
-8.4
A
Pulsed Drain Current (10
μs pulse, duty cycle = 1%)
IDM
-80
A
Maximum Continuous Body Diode Forward Current (Note 6)
IS
-3.6
A
Avalanche Current (Note 7) L=0.3 mH
IAS
-17.5
A
Avalanche Energy (Note 7) L=0.3 mH
EAS
64
mJ
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Units
Total Power Dissipation (Note 5)
PD
0.95
W
Thermal Resistance, Junction to Ambient (Note 5)
Steady State
RJA
137
°C/W
t<10s
65
°C/W
Total Power Dissipation (Note 6)
PD
2.3
W
Thermal Resistance, Junction to Ambient (Note 6)
Steady State
RJA
55
°C/W
t<10s
26
°C/W
Thermal Resistance, Junction to Case (Note 6)
RJC
6.14
°C/W
Operating and Storage Temperature Range
TJ, TSTG
-55 to +150
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage
BVDSS
-30
-
-
V
VGS = 0V, ID = -250μA
Zero Gate Voltage Drain Current
IDSS
-
-
-1.0
μA
VDS = -30V, VGS = 0V
Gate-Source Leakage
IGSS
-
-
±100
nA
VGS = ±25V, VDS = 0V
ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage
VGS(th)
-1.0
-2.0
-2.5
V
VDS = VGS, ID = -250μA
Static Drain-Source On-Resistance
RDS (ON)
-
13
20
m
Ω
VGS = -10V, ID = -8A
-
18.4
29
VGS = -5V, ID = -5A
Diode Forward Voltage
VSD
-
-0.74
-1.0
V
VGS = 0V, IS = -1A
DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance
Ciss
-
1931
-
pF
VDS = -15V, VGS = 0V,
f = 1.0MHz
Output Capacitance
Coss
-
226
-
pF
Reverse Transfer Capacitance
Crss
-
168
-
pF
Gate Resistance
Rg
-
10.9
-
Ω
VDS = 0V, VGS = 0V, f = 1MHz
Total Gate Charge VGS = -5V
Qg
-
8.8
-
nC
VDS = -15V, VGS = -10V, ID = -10A
Total Gate Charge VGS = -10V
Qg
-
16.5
-
nC
Gate-Source Charge
Qgs
-
2.6
-
nC
Gate-Drain Charge
Qgd
-
3.6
-
nC
Turn-On Delay Time
tD(on)
-
8.2
-
ns
VGEN = -10V, VDD = -15V,
RGEN = 3Ω, ID = -10A
Turn-On Rise Time
tr
-
14
-
ns
Turn-Off Delay Time
tD(off)
-
65
-
ns
Turn-Off Fall Time
tf
-
31.6
-
ns
Notes:
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
7. UIS in production with L = 0.1mH, starting TA = +25°C.
8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to product testing.



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