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DMP3099L-13. Datasheet(PDF) 2 Page - Diodes Incorporated |
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DMP3099L-13. Datasheet(HTML) 2 Page - Diodes Incorporated |
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2 / 6 page ![]() DMP3099L Document number: DS36081 Rev. 3 - 2 2 of 6 www.diodes.com May 2013 © Diodes Incorporated DMP3099L Maximum Ratings (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Units Drain-Source Voltage VDSS -30 V Gate-Source Voltage VGSS ±20 V Drain Current (Note 5) VGS = -10V Steady State TA = +25°C TA = +70°C ID -3.8 -2.9 A Pulsed Drain Current (Note 6) IDM -11 A Thermal Characteristics Characteristic Symbol Value Units Total Power Dissipation (Note 5) PD 1.08 W Thermal Resistance, Junction to Ambient @TA = +25°C (Note 5) RθJA 115 °C/W Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C Electrical Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Min Typ Max Unit Test Condition OFF CHARACTERISTICS (Note 7) Drain-Source Breakdown Voltage BVDSS -30 — — V VGS = 0V, ID = -250µA Zero Gate Voltage Drain Current IDSS — — -800 nA VDS = -30V, VGS = 0V Gate-Source Leakage IGSS — — ±100 nA VGS = ±20V, VDS = 0V ON CHARACTERISTICS (Note 7) Gate Threshold Voltage VGS(th) -1.0 — -2.1 V VDS = VGS, ID = -250µA Static Drain-Source On-Resistance RDS(ON) — — 65 99 mΩ VGS = -10V, ID = -3.8A VGS = -4.5V, ID = -3.0A Forward Transfer Admittance |Yfs| — 3.6 — S VDS = -5V, ID = -2.7A Diode Forward Voltage (Note 6) VSD — — -1.26 V VGS = 0V, IS = -2.7A DYNAMIC CHARACTERISTICS (Note 8) Input Capacitance Ciss — 563 — pF VDS = -25V, VGS = 0V, f = 1.0MHz Output Capacitance Coss — 48 — pF Reverse Transfer Capacitance Crss — 41 — pF Gate Resistance RG — 10.3 — Ω VGS = 0V VDS = 0V, f = 1MHz SWITCHING CHARACTERISTICS (Note 8) Total Gate Charge Qg — 5.2 — nC VDS = -15V, VGS = -4.5V, ID = -3.8A — 11 — VDS = -15V, VGS = -10V, ID = -3.8A Gate-Source Charge Qgs — 1.7 — Gate-Drain Charge Qgd — 1.9 — Turn-On Delay Time td(on) — 4.8 — ns VDS = -15V, VGS = -10V, ID = -1A, RG = 6.0Ω Rise Time tr — 5.0 — Turn-Off Delay Time td(off) — 31 — Fall Time tf — 15 — Notes: 5. Device mounted on FR-4 PCB on 2 oz., 0.5 in. 2 copper pads and t ≤5 sec. 6. Pulse width ≤10µS, Duty Cycle ≤1%. 7. Short duration pulse test used to minimize self-heating effect. 8. Guaranteed by design. Not subject to production testing. |
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