SN003232CPWR datasheet(4/27 Pages) TI1

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MAX3232

SLLS410K – JANUARY 2000 – REVISED JANUARY 2015

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7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VCC

Supply voltage range(2)

–0.3

V+

Positive output supply voltage range(2)

–0.3

V–

Negative output supply voltage range(2)

–7

0.3

V+ – V–

Supply voltage difference(2)

Drivers

–0.3

Input voltage range

Receivers

–25

Drivers

–13.2

13.2

Output voltage range

Receivers

–0.3

VCC + 0.3

Operating virtual junction temperature

150

°C

Tstg

Storage temperature range

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to network GND.

7.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001

15000

RIN , DOUT, and GND pins (1)

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001

3000

V(ESD)

Electrostatic discharge

All other pins(1)

Charged device model (CDM), per JEDEC specification JESD22-C101,

1000

all pins(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

(see Figure 6)

(1)

MIN

NOM

MAX

UNIT

VCC = 3.3 V

3.3

3.6

VCC

Supply voltage

VCC = 5 V

4.5

5.5

VCC = 3.3 V

VIH

Driver high-level input voltage

DIN

VCC = 5 V

2.4

VIL

Driver low-level input voltage

DIN

0.8

Driver input voltage

DIN

5.5

Receiver input voltage

RIN

–25

MAX3232C

Operating free-air temperature

°C

MAX3232I

–40

(1)

Test conditions are C1–C4 = 0.1

μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.

7.4 Thermal Information

MAX3232

THERMAL METRIC(1)

SOIC

SSOP

SOIC

TSSOP

UNIT

16 PINS

RθJA

Junction-to-ambient thermal resistance

108

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).

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