LM3530TME-40SLASHNOPB datasheet(4/50 Pages) TI1

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LM3530

SNVS606L – JUNE 2009 – REVISED DECEMBER 2014

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7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2) (3)

MIN

MAX

UNIT

VIN to GND

–0.3

VSW, VOVP, VILED to GND

VSCL, VSDA, VALS1, VPWM, VINT, VHWEN to GND

VALS2 to GND

–0.3 V to VIN + 0.3 V

Continuous power dissipation

Internally limited

Junction temperature (TJ-MAX)

150

°C

Maximum lead temperature (soldering, 10s)

See(4)

Storage temperature, Tstg

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

All voltages are with respect to the potential at the GND pin.

(4)

For detailed soldering specifications and information, please refer to Application Note 1112: DSBGA Wafer Level Chip Scale Package

(SNVA009).

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VIN to GND

2.7

5.5

VSW, VOVP, VILED, to GND

Junction temperature (TJ)

(1)

–40

125

°C

Ambient temperature (TA)

(2)

–40

(1)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ= 140°C (typ.) and

disengages at TJ= 125°C (typ.).

(2)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the

part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX).

7.4 Thermal Information

DSBGA

THERMAL METRIC(1)

YFQ

YFZ

UNIT

12 PINS

RθJA

Junction-to-ambient thermal resistance(2)

61.7

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

Junction-to-ambient thermal resistance (RθJA) is taken from a thermal modeling result, performed under the conditions and guidelines

set forth in the JEDEC standard JESD51-7. The test board is a 4-layer FR-4 board measuring 102 mm x 76 mm x 1.6 mm with a 2 x 1

array of thermal vias. The ground plane on the board is 50 mm x 50 mm. Thickness of copper layers are 36 µm/18 µm/18 µm/3 6µm

(1.5oz/1oz/1oz/1.5oz). Ambient temperature in simulation is 22°C in still air. Power dissipation is 1W. The value of RθJA of this product in

the DSBGA package could fall in a range as wide as 60ºC/W to 110ºC/W (if not wider), depending on PCB material, layout, and

environmental conditions. In applications where high maximum power dissipation exists special care must be paid to thermal dissipation

issues.

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