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SP2526A Datasheet(PDF) 7 Page - Exar Corporation |
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SP2526A Datasheet(HTML) 7 Page - Exar Corporation |
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7 / 9 page  S SP P2 25 52 26 6A A D Du ua all C Ch ha an nn ne ell U US SB B P Po ow we err D Diis sttrriib bu uttiio on n S Sw wiittcch h © 2011 Exar Corporation 7/9 Rev. 2.1.0 APPLICATION INFORMATION ERROR FLAG An open-drained output of an N-channel MOSFET, the FLG output is pulled low to signal the following fault conditions: input undervoltage, output current limit, and thermal shutdown. CURRENT LIMIT The current limit threshold is preset internally. It protects the output MOSFET switches from damage resulting from undesirable short circuit conditions or excess inrush current, which is often encountered during hot plug-in. The low limit of the current limit threshold of the SP2526A allows a minimum current of 0.6A through the MOSFET switches. A current limit condition will signal the Error Flag. THERMAL SHUTDOWN When the chip temperature exceeds 135ºC for any reason other than overcurrent fault of either one of the two MOSFETs, the thermal shutdown function turns off both MOSFET switches and signals the error flag. A hysteresis of 10ºC prevents the MOSFETs from turning back on until the chip temperature drops below 125ºC. However, if thermal shutdown is triggered by chip temperature rise resulting from overcurrent fault condition of either one of the MOSFET switches, the thermal shutdown function will only turn off the switch that is in overcurrent condition and the other switch can still remain its normal operation. In other words, the thermal shutdown function of the two switches is independent of each other in the case of overcurrent fault. SUPPLY FILTERING A 0.1μF to 1μF bypass capacitor from IN to GND, located near the device, is strongly recommended to control supply transients. Without a bypass capacitor, an output short may cause ringing on the input (from supply lead inductance) which can damage internal control circuitry. TRANSIENT REQUIREMENTS USB supports dynamic attachment (hot plugin) of peripherals. A current surge is caused by the input capacitance of a downstream device. Ferrite beads are recommended in series with all power and ground connector pins. Ferrite beads reduce EMI and limit the inrush current during hot- attachment by filtering high-frequency signals. SHORT CIRCUIT TRANSIENT Bulk capacitance provides the short-term transient current needed during a hot- attachment event. A 33μF/16V tantalum or a 100μF/10V electrolytic capacitor mounted close to the downstream connector at each port should provide sufficient transient drop protection. PRINTED CIRCUIT LAYOUT The Power circuitry of USB printed circuit boards requires a customized layout to maximize thermal dissipation and to minimize voltage drop and EMI. TEST CIRCUIT |
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