16-PIN SURFACE

MOUNT

L*

H*

LM7372

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SNOS926F – MAY 1999 – REVISED SEPTEMBER 2014

Application Details (continued)

Figure 25. Copper Heatsink Patterns

The LM7372 is available in the 16-Pin SOIC package. Since only 8 pins are needed for the two operational

amplifiers, the remaining pins are used for heat sink purposes. Each of the end pins, 1,8,9 & 16 are internally

bonded to the lead frame and form an effective means of transferring heat to external copper. This external

copper can be either electrically isolated or be part of the topside ground plane in a single supply application.

Figure 25 shows a copper pattern which can be used to dissipate internal heat from the LM7372. Table 1 gives

Table 1. 16-Pin SOIC Thermal Resistance with Area of Cu

L (in)

H (in)

1

0.5

83

2

1

70

3

1.5

67

temperature.

An even better package for removing internally generated heat is a package with an exposed die attach paddle.

Improved removal of internal heat can be achieved by directly connecting bond wires to the lead frame inside the

package. Since this lead frame supports the die attach paddle, heat is transferred directly from the substrate to

the outside copper by these bond wires. The LM7372 is also available in the 8-Pin SO PowerPAD package. For

this package the entire lower surface of the paddle is not covered with plastic, which would otherwise act as a

thermal barrier to heat transfer. Heat is transferred directly from the die through the paddle rather than through

weights of copper are tabulated in Table 2.

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