LMH6559MASLASHNOPB datasheet(2/36 Pages) TI1

2 / 36 page

LMH6559

SNOSA57C – APRIL 2003 – REVISED MARCH 2013

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Absolute Maximum Ratings

(1) (2)

ESD Tolerance(3)

Human Body Model

2000V

Machine Model

200V

Output Short Circuit Duration

See(4),(5) and (6)

Supply Voltage (V+ – V−)

13V

Voltage at Input/Output Pins

V+ +0.8V, V−

−0.8V

Soldering Information

Infrared or Convection (20 sec.)

235°C

Wave Soldering (10 sec.)

260°C

Storage Temperature Range

−65°C to +150°C

Junction Temperature

+150°C

(1)

Absolute Maximum Ratings are those values beyond which the safety of the device cannot be ensured. They are not meant to imply that

the devices should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of device operation.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of

JEDEC). Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).

(4)

Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in

exceeding the maximum allowed junction temperature of 150°C.

(5)

Short circuit test is a momentary test.

(6)

The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX) – TA) / θJA. All numbers apply for packages soldered directly onto a PC board.

Operating Ratings

(1)

Supply Voltage (V+ - V−)

3 - 10V

Temperature Range(2)(3)

−40°C to +85°C

Package Thermal Resistance(2)(3)

8-Pin SOIC

172°C/W

5-Pin SOT-23

235°C/W

(1)

Absolute Maximum Ratings are those values beyond which the safety of the device cannot be ensured. They are not meant to imply that

the devices should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of device operation.

(2)

The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX) – TA) / θJA. All numbers apply for packages soldered directly onto a PC board.

(3)

Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very

limited self-heating of the device such that TJ = TA. There is no specification of parametric performance as indicated in the electrical

tables under conditions of internal self-heating where TJ > TA. See Applications section for information on temperature de-rating of this

device.

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