LMH6640MFSLASHNOPB datasheet(2/22 Pages) TI1

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LMH6640

SNOSAA0B – FEB 2004 – REVISED MARCH 2013

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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1)

ESD Tolerance (2)

Human Body Model

2 KV

Machine Model

200V

VIN Differential

±2.5V

Input Current

±10 mA

Supply Voltages (V+ – V−)

18V

Voltage at Input/Output Pins

V+ +0.8V, V−

−0.8V

Storage Temperature Range

−65°C to +150°C

Junction Temperature (3)

+150°C

Soldering Information

Infrared or Convection (20 sec.)

235°C

Wave Soldering (10 sec.)

260°C

(1)

Absolute maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For specifications and the test conditions, see the

Electrical Characteristics.

(2)

Human body model, 1.5 k

Ω in series with 100 pF. Machine Model, 0Ω in series with 200 pF.

(3)

The maximum power dissipation is a function of TJ(MAX), θJA , and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX)-TA ) / θJA. All numbers apply for packages soldered directly onto a PC board.

Operating Ratings

(1)

Supply Voltage (V+ – V−)

4.5V to 16V

Operating Temperature Range (2)

−40°C to +85°C

Package Thermal Resistance (2)

5-Pin SOT-23

265°C/W

(1)

Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in

exceeding the maximum allowed junction temperature of 150 °C Short circuit test is a momentary test. Output short circuit duration is

infinite for VS < 6V at room temperature and below. For VS > 6V, allowable short circuit duration is 1.5 ms.

(2)

The maximum power dissipation is a function of TJ(MAX), θJA , and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX)-TA ) / θJA. All numbers apply for packages soldered directly onto a PC board.

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